Dry/Plasma Etch Process Development Engineer (SM1)

118-WW TMG MFG OPS; Lenexa (KS); On-site; USD 120,000 - 160,000; Full time

Job summary

118-WW TMG MFG OPS is seeking an Advanced Process Development Engineer to join the Plasma Etch Process Development team in Lenexa, KS. The role focuses on developing, optimizing, and transferring advanced plasma etch processes to support next-generation semiconductor technologies.

The ideal candidate has 8+ years in semiconductor plasma/dry etch process development, strong SPC/DOE/analysis skills, and experience collaborating with integration, metrology, and manufacturing teams to enable

Qualifications

• Experience leading plasma/dry etch process development for semiconductor devices.
• Strong foundation in SPC, ECR and process release strategies.
• Experience with DOE methodologies and statistical analysis.
• Familiarity with metrology techniques including SEM, CD-SEM, ellipsometry and defect inspection tools.

Responsibilities

• Develop and optimize plasma etch processes for advanced semiconductor devices.
• Design and execute DOE studies to improve etch rate, selectivity, CD control, profile, defectivity and uniformity.
• Characterize performance and establish process windows for manufacturing robustness.
• Collaborate with device integration, metrology, equipment engineering, and manufacturing teams.
• Lead technology transfer activities and establish process specifications, control plans and release docs.
• Mentor junior engineers and participate in cross-functional reviews.

Skills

DOE methodologies

Statistical data analysis

Statistical process control

Root cause analysis

Cross-functional collaboration

Education

Bachelor's in Engineering

Tools

Python

Claude

Ellipsometry

Defect inspection tools

Job description

Change the world. Love your job.
We are seeking a highly motivated Advanced Process Development Engineer to join our Plasma Etch Process Development team. This role is responsible for developing, optimizing, and transferring advanced plasma etch processes supporting next-generation semiconductor technologies. The engineer will work closely with integration, equipment, metrology, and manufacturing teams to drive technology innovation, improve process capability, and enable successful product ramp into high-volume manufacturing.

The ideal candidate possesses strong technical expertise in plasma etch fundamentals, semiconductor process development, statistical data analysis, and cross-functional problem solving.

The responsibilities of a Manufacturing Development Process Engineer in this role include:

• Process Development
  • Develop and optimize plasma etch processes for advanced semiconductor devices.
  • Design and execute experiments (DOE) to improve critical process metrics, including:
    • Etch rate
    • Selectivity
    • Critical dimension (CD) control
    • Profile control
    • Defectivity
    • Uniformity
  • Characterize process performance and establish process windows for manufacturing robustness.
  • Evaluate new process chemistries, hardware configurations, and chamber technologies.
• Technology Introduction
  • Support development and qualification of next-generation etch technologies.
  • Collaborate with device integration teams to meet product and technology requirements.
  • Drive process readiness for technology transfers from development into manufacturing.
  • Establish process specifications, control plans, and release documentation.
• Tool and Equipment Engineering
  • Partner with equipment engineering teams to improve tool capability, productivity, and reliability.
  • Lead chamber matching, equipment qualification, and process performance improvement activities.
  • Support installation and startup of new etch platforms.
• Data Analysis & Continuous Improvement
  • Analyze complex process datasets using statistical methods and data analytics tools.
  • Identify root causes of process excursions and implement corrective actions.
  • Lead yield improvement and defect reduction initiatives.
  • Utilize SPC methodologies to monitor and improve process stability.
• Cross-Functional Collaboration
  • Work closely with:
    • Process Integration
    • Manufacturing
    • Yield Engineering
    • Metrology
    • Equipment Engineering
    • Quality and Reliability teams
  • Present technical findings and recommendations to management and key stakeholders.
  • Mentor junior engineers and technicians as needed.

Minimum requirements:

• 8+ years of semiconductor plasma/dry etch process development experience.
• Bachelors in an engineering discipline
• Strong foundation in statistical process control, engineering change control and process release strategies
• Experience with DOE methodologies and statistical analysis.
• Familiarity with metrology techniques including SEM, CD-SEM, ellipsometry and defect inspection tools.

Preferred qualifications:

• Strong foundation in statistical process control, engineering change control and process release strategies
• Proficiency with Python, Claude, or other AI models or tools is a plus
• Demonstrated strong analytical and problem solving skills resulting in innovative and creative process solutions
• Experience with process development and transfer on etch platforms (LAM, AMAT, TEL, etc)
• Strong verbal and written communication skills
• Ability to work in teams and collaborate effectively with people in different job functions
• Strong time management skills that enable on-time project delivery
• Demonstrated ability to build strong, influential relationships
• Ability to work effectively in a fast-paced and rapidly changing environment
• Ability to take the initiative and drive for result