Dry Etch Process Develop Engineer

Micron Technology, Inc; City of Albany (NY); On-site; USD 107,000 - 182,000; Full time

Benefits offered by this job

Medical, dental, and vision plans

Paid family leave

Paid time off and holidays

Job summary

Micron Technology, Inc in Albany, NY is seeking a Dry Etch Process Engineer to develop and optimize plasma etch processes for next-generation memory devices. The role involves hands-on work with etch equipment and collaboration with various technical teams to transition processes from R&D to high-volume manufacturing.

Qualifications include an M.S. or Ph.D. in a relevant field, with experience in semiconductor processing being a significant advantage. The position offers a base salary range of $107,000 to $182,000 per year, along with comprehensive benefits.

Qualifications

• M.S. or Ph.D. in relevant field regarding plasma processing and semiconductor manufacturing.
• Experience in semiconductor process development or sustaining engineering.
• Working knowledge of plasma etch fundamentals.

Responsibilities

• Develop and sustain dry etch unit processes for advanced memory technologies.
• Optimize process metrics including CD control and uniformity.
• Drive defect reduction and yield improvement using statistical data analysis.

Skills

Semiconductor processing

Process characterization

Data analysis

Cross-functional collaboration

Education

M.S. or Ph.D. in Electrical Engineering, Materials Science or related field

B.S. with 3+ years of semiconductor processing experience

Tools

Dry etch equipment

Statistical process control (SPC)

Job description

About the Role

As a Dry Etch Process Engineer you will develop, integrate, and optimize plasma etch processes that enable next-generation memory devices. You will work hands‑on with etch equipment, chamber hardware, consumables, and metrology, using data‑driven methods to improve critical dimension control, profile, selectivity, uniformity, and defect performance. You will collaborate closely with integration, lithography, thin films, CMP, device, and manufacturing teams to mature processes from R&D into high-volume manufacturing.

Responsibilities

• Develop, qualify, and sustain dry etch (plasma) unit processes for advanced memory technologies (e.g., dielectric, conductor, and hardmask etch).
• Optimize critical process metrics including CD control, etch profile/anisotropy, selectivity, microloading, uniformity, and line edge/line width roughness.
• Drive defect reduction and yield improvement using inline/out‑of‑line metrology, DOEs, SPC, and statistical data analysis.
• Perform root‑cause analysis and implement corrective actions for process excursions, tool health issues, and integration‑related failures.
• Partner with equipment vendors on chamber matching, hardware and recipe development, new capability evaluations, and cost‑of‑ownership improvements.
• Document process baselines, change controls, and learning; communicate results and support technology transfer to high‑volume manufacturing.

Minimum Qualifications

• M.S. or Ph.D. in Electrical Engineering, Materials Science, Physics, Chemistry, Chemical Engineering, Mechanical Engineering, or a related field relevant to plasma processing and semiconductor manufacturing.
• B.S. with 3+ years of semiconductor processing experience with emphasis on dry etch/plasma etch will also be considered.
• Experience in semiconductor process development or sustaining engineering, including DOE planning/execution and statistical data analysis.
• Working knowledge of plasma etch fundamentals, chamber hardware, and process characterization (profile, CD, selectivity, uniformity, defectivity).
• Ability to collaborate effectively across cross‑functional technical teams and communicate results clearly.

Preferred Qualifications

• Hands‑on experience with advanced dry etch platforms (e.g., ICP/RIE) and chamber matching across fleets.
• Familiarity with pattern transfer challenges (ARDE, microloading, footing/notching) and integration with lithography/hardmask stacks.
• Experience with defect characterization techniques and tool health monitoring methodologies.
• Experience working with semiconductor equipment vendors, joint development programs, or R&D environments.
• Familiarity with technology transfer to high‑volume manufacturing and sustaining support in a fab environment.

Job Profile

Semiconductor Process Engineer 4

Relocation Level: TBD

Compensation

US base salary range: $107,000 – $182,000 per year.

Benefits

Micron offers medical, dental, vision plans, income protection, paid family leave, paid time off, and paid holidays.

EEO Statement

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity, or any other factor protected by applicable federal, state, or local laws.

Contact

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For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at [e-mail] or 1‑800‑336‑8918 (select option #3).