Dry / Lami Process Engineer

Absolics Inc.; Covington (GA); On-site; USD 70,000 - 80,000; Full time

Benefits offered by this job

401K 6% matching (NO vesting period)

Healthcare 100% support (Health,Dental

Job summary

Absolics Inc. in Covington, GA is seeking a junior process engineer to lead lamination and embedding processes for high-performance packaging. You will drive process development, optimize PVD and plasma steps, and resolve manufacturing issues to improve product quality and yield.

The role requires a Bachelor’s degree in engineering and up to 1 year of semiconductor experience. Strong analytical and problem-solving skills are essential, along with the ability to work independently and with teams.

Qualifications

• Strong analytical and creative problem-solving skills.
• Ability to use extensive technical knowledge to guide strategic directions.
• Ability to resolve complex issues through root-cause or model-based problem solving.

Responsibilities

• Lead lamination processes for ABF bonding and substrate assembly.
• Oversee process management by statistical tools.
• Manage equipment setup and maintenance.
• Lead and optimize embedding processes for performance and reliability.
• Improve process issues based on DOE analysis.
• Respond to customer issues and drive root-cause improvements.

Skills

Analytical skills

Creative problem-solving

Technical knowledge

Root-cause analysis

Education

Bachelor’s degree in mechanical, electrical/electronic, chemical Engineering

Job description

Absolics is a leading provider of advanced packaging technologies and services, offering scalable solutions for businesses of high-performance computing.We offer smart, innovative services to dozens of clients globally. We are looking for process (Dry/Lami) junior engineer. This position is responsible for Film lamination, Embedding (Pick and Place / Ink Dispensing), PVD, and Plasma de-smear/descum/drill.Also responsible for starting up, developing, and optimizing processes to improve product quality, driving process yield improvements, cost reduction, productivity improvement and risk management as well as resolving manufacturing line problems.You will be also required to identify, diagnose, and resolve process related problems by applying failure analysis.

DUTIES/RESPONSIBILITIES:

• Lead lamination processes for ABF bonding and substrate assembly
• Oversee process management by statistical tools
• Manage equipment set up and maintenance
• Lead and optimize embedding processes for performance and reliability
• Improve process issues based on DOE analysis
• Response to customer issues
• Direct root cause analysis and improvement plan

REQUIREMENT:

• Strong analytical and creative problem-solving skills
• Ability to use extensive technical knowledge to guide strategic directions
• Ability to resolve complex issues through root-cause or model-based problem solving

QUALITIFICATION:

• Ability to work independently, with minimum direction, and a focus on meeting commitments
• Must be at least 18 years old and authorized to work in the United States
• ability to be a team player who works collaboratively and effectively with others

EDUCATION:

• Bachelor’s degree in mechanical, electrical/electronic, chemical Engineering

EXPERIENCE:

• 1 year experiences in Semiconductor industry preferred but not required

SALARY:

• $70,000 – $80,000

BENEFIT:

• 401K 6% matching (NO vesting period)
• Healthcare 100% support (Health, Dental, Vision)