Dry / Lami Process Engineer

Absolics Inc.; Covington (GA); On-site; USD 70,000 - 80,000; Full time

Benefits offered by this job

401K 6% matching

Healthcare coverage

Life and disability insurance

Cell phone allowance

PTO & self-development

Job summary

Absolics Inc. in Covington, GA is seeking a process engineer focused on dry/lamination and embedding processes for ABF bonding and substrate assembly.

You will startup, develop, and optimize processes to improve product quality, yield, and productivity while reducing costs and managing risk on manufacturing lines. The role requires strong analytical and problem-solving abilities, the ability to work independently, and 18+ years old with authorization to work in the United States.

Qualifications

• Must be able to work independently with minimal direction.
• Must be at least 18 years old and authorized to work in the United States.
• Ability to be a team player who collaborates effectively with others.

Responsibilities

• Lead lamination processes for ABF bonding and substrate assembly.
• Oversee process management by statistical tools.
• Manage equipment set up and maintenance.
• Lead and optimize embedding processes for performance and reliability.
• Establish standard documents (work standards/cleaning standards).
• Conduct failure mode analysis (reliability, TO, overshoot, etc.).
• Improve process issues based on DOE analysis.
• Response to customer issues.
• Direct root cause analysis and improvement plan.

Skills

Analytical skills

Problem solving

Root-cause analysis

DOE analysis

Education

Bachelor's degree in mechanical, electrical/electronic, chemical engineering

Job description

Job Summary

Absolics is a leading provider of advanced packaging technologies and services, offering scalable solutions for businesses of high-performance computing. We offer smart, innovative services to dozens of clients globally. We are looking for a process (Dry/Lami) junior engineer. This position is responsible for film lamination, embedding (pick and place/ink dispensing), PVD, and plasma de‑smear/descum/drill. Also responsible for starting up, developing, and optimizing processes to improve product quality, driving process yield improvements, cost reduction, productivity improvement, and risk management as well as resolving manufacturing line problems. You will also be required to identify, diagnose, and resolve process related problems by applying failure analysis.

Duties / Responsibilities

• Lead lamination processes for ABF bonding and substrate assembly
• Oversee process management by statistical tools
• Manage equipment set up and maintenance
• Lead and optimize embedding processes for performance and reliability
• Establish standard documents (work standards/cleaning standards)
• Conduct failure mode analysis (reliability, T.O., overshoot, etc.)
• Improve process issues based on DOE analysis
• Response to customer issues
• Direct root cause analysis and improvement plan

Requirements

• Strong analytical and creative problem‑solving skills
• Ability to use extensive technical knowledge to guide strategic directions
• Ability to resolve complex issues through root‑cause or model‑based problem solving

Qualifications

• Ability to work independently, with minimum direction, and a focus on meeting commitments
• Must be at least 18 years old and authorized to work in the United States
• Ability to be a team player who works collaboratively and effectively with others

Education

• Bachelor’s degree in mechanical, electrical/electronic, chemical engineering

Experience

• 1 year experience in semiconductor industry preferred but not required

Salary

• $70,000 – $80,000

Benefits

• 401K 6% matching (no vesting period)
• Healthcare 100% support (health, dental, vision)
• Life, STD, LTD 100% support
• Cell phone allowance
• PTO and self‑development