Dry Etch Module Lead - Engineering & Operations

Intel Corporation; Phoenix (AZ); On-site; USD 121,000 - 232,000; Full time

Benefits offered by this job

Stock bonuses

Health benefits

Retirement plan

Vacation

Job summary

Intel Corporation in Phoenix, AZ seeks a Dry Etch Module Team Leader to drive performance and development of engineers and technicians. You will partner with other leaders to operate as one team, delivering consistent results across functional areas while steering the roadmap to meet safety, cost, quality, and training goals.

The role requires strong communication, problem solving, and data-analysis skills, with MBPS and process-flow experience.

Qualifications

• Bachelor of Science in a related science or engineering field with 4+ years wafer fabrication experience.
• MS in a related science or engineering field with 2+ years wafer fabrication experience.
• PhD in a related science or engineering field.
• 1+ year of experience handling semiconductor process flow, equipment troubleshooting and Model Based Problem Solving skills.

Responsibilities

• Oversee performance, development, and employee relations of engineers and technicians.
• Partner with other Group Leaders and MTLs to ensure consistency across functional areas.
• Lead roadmap to meet goals in safety, cost, quality, availability, training, and employee relations.

Skills

Communication skills

Leadership

Data analysis

Model Based Problem Solving

Education

BS in related science/engineering

MS in related science/engineering

PhD in related science/engineering

Job description

Intel Corporation in Phoenix, AZ seeks a Dry Etch Module Team Leader to drive performance and development of engineers and technicians. You will partner with other leaders to operate as one team, delivering consistent results across functional areas while steering the roadmap to meet safety, cost, quality, and training goals.

The role requires strong communication, problem solving, and data-analysis skills, with MBPS and process-flow experience.