Lead Dry Etch MDE Engineer - Shift Leadership & Impact

Micron Technology; Boise (ID); On-site; USD 120,000 - 180,000; Full time

Job summary

Micron Technology in Boise leads a dry etch development program within a 24/7 development environment, guiding a multi-shift team to advance DRAM technology. You will own execution, mentor engineers, and partner across process, integration, and manufacturing to accelerate learning and delivery.

The role emphasizes people leadership, operational performance, and the application of plasma etch science to improve throughput and data quality across wafer lots.

Qualifications

• Bachelor’s degree in engineering or equivalent semiconductor experience.
• Experience in dry etch process development and plasma fundamentals.
• Demonstrated leadership in a technical or manufacturing environment.
• Strong problem‑solving and communication skills.
• Ability to manage execution across multiple teams and priorities.

Responsibilities

• Lead dry etch development execution and ensure efficient wafer flow and data quality
• Manage and develop engineers across shifts through coaching and mentorship
• Drive operational performance including cycle time, tool readiness, and execution metrics
• Partner with process, integration, and manufacturing teams to resolve issues
• Improve systems and workflows to increase development throughput

Skills

Dry etch process development

Leadership

Plasma fundamentals

Problem solving

Communication

Cross-functional collaboration

Education

Bachelor’s degree in engineering or equivalent semiconductor experience

PhD or MS with 5+ years, or BS with 10+ years of semiconductor experience

Job description

Micron Technology in Boise leads a dry etch development program within a 24/7 development environment, guiding a multi-shift team to advance DRAM technology. You will own execution, mentor engineers, and partner across process, integration, and manufacturing to accelerate learning and delivery.

The role emphasizes people leadership, operational performance, and the application of plasma etch science to improve throughput and data quality across wafer lots.