Director of Embedded Software Engineering

Teledyne; Goleta (CA); On-site; USD 178,000 - 237,000; Full time

Job summary

Teledyne Technologies Incorporated seeks a Software Engineering Group Leader to guide the team from concept to manufacturing, in a general office and engineering lab setting. You will oversee staffing, planning, and validation of designs while maintaining quality processes and hands‑on coding as needed.

The role requires extensive experience in managing engineering groups and deep expertise in embedded software, C/C++, assembly, and imaging/electro‑optical components.

Qualifications

• Minimum 10 years of experience in managing engineering groups and 15 years’ experience in software areas.
• Developing strategies for software and deploying software development tools.
• Architecture, designing, implementing, and testing embedded systems software.
• Designing and testing software in C/C++ and assembly for imaging/electro‑optical components.
• Word, Excel, and PowerPoint skills are required.

Responsibilities

• Supervise a division of the Software Engineering group with resource allocation and hiring.
• Validate technical solutions and schedules proposed by design engineers.
• Report performance and ensure bandwidth availability at max capacity.
• Establish a quality process to enable design reuse while allowing innovation.
• Hands‑on role in writing specs, trade‑offs, design reviews, coding and troubleshooting.

Skills

Team management

Software strategy

Dev tools

Embedded software

C/C++/Assembly

MS Office

Office suite

Tools

Linux/OpenSource

Visual Studio

Job description

Teledyne Technologies Incorporated seeks a Software Engineering Group Leader to guide the team from concept to manufacturing, in a general office and engineering lab setting. You will oversee staffing, planning, and validation of designs while maintaining quality processes and hands‑on coding as needed.

The role requires extensive experience in managing engineering groups and deep expertise in embedded software, C/C++, assembly, and imaging/electro‑optical components.