Director of Advanced Bonding & Packaging Applications

Diamond Foundry; San Francisco (CA); On-site; USD 180,000 - 270,000; Full time

Benefits offered by this job

Equity

Health insurance

Retirement plan

Life and disability insurance

Paid time off

Employee discounts to VRAI

Job summary

Diamond Foundry Inc. seeks an experienced Director of Application Engineering to lead bonding of single-crystal diamond to semiconductor devices in advanced packaging and thermal management applications.

You will own the bonding technology strategy, guide prototyping through qualification to mass production, and build a team that delivers robust solutions for AI and chip customers. Strong leadership and hands-on lab skills required.

Qualifications

• Bachelor or higher in a materials/engineering field; advanced degrees preferred.
• 10+ years in semiconductor packaging or thermal management; 3+ yrs leading teams.
• Hands-on bonding tech expertise: surface prep, metallization, metrology, reliability.
• Deep knowledge of 2.5D/3D packaging and related thermal challenges.
• Proven track record moving from R&D to mass production with tech transfer.
• Excellent communication and executive presence; ability to convey tech to leadership.

Responsibilities

• Lead and grow the application engineering function for bonding single-crystal diamond to devices.
• Own bonding strategy across pressure, thermocompression, plasma-activated methods and more.
• Direct process development, DOE-based optimization, characterization and reliability testing.
• Lead customer programs from prototyping through qualification and scale-up.
• Collaborate on roadmaps and resourcing with executives, R&D, product, and BD; report risks and results.
• Present technical results and strategy to customers, executives, and partners.

Skills

Bonding technologies

Advanced packaging

Team leadership

Technical communication

Education

Bachelor’s degree in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field

Master’s or PhD preferred

Tools

Wafer/die bonding processes

Metallization

DOE optimization

Metrology & reliability testing

Job description

Diamond Foundry Inc. seeks an experienced Director of Application Engineering to lead bonding of single-crystal diamond to semiconductor devices in advanced packaging and thermal management applications.

You will own the bonding technology strategy, guide prototyping through qualification to mass production, and build a team that delivers robust solutions for AI and chip customers. Strong leadership and hands-on lab skills required.