Director, Engineering & Technical Marketing - Req #499

ASE Global; Austin (TX); On-site; USD 140,000 - 230,000; Full time

Benefits offered by this job

Medical Insurance

Dental Insurance

Vision Insurance

401(k) Plan

Flex Plan

Job summary

ASE (U.S.) INC. in Austin seeks a Director of Engineering & Technical Marketing to promote strategic technologies and packaging platforms, drive market adoption, ecosystem leadership, and revenue growth with customers worldwide.

You will translate customer roadmaps into technology strategies, lead technical marketing materials and presentations, and collaborate with Sales, R&D, and Factory teams to align roadmaps with business goals while representing ASE at industry forums.

Qualifications

• 12+ years in semiconductor industry or packaging technology
• Bachelor’s, Master’s or Ph.D. in Electrical/Materials/Mechanical/Chemical Engineering, Physics, or related field
• Strong verbal, written, and interpersonal communication skills
• Ability to deliver technical presentations and develop customer proposals
• Experience with DOE methodologies, BOM development, and thermo-mechanical assessments
• Willingness to travel domestically and internationally

Responsibilities

• Promote strategic technology platforms to global customers and partners
• Create technical marketing materials (presentations, white papers, briefs)
• Deliver technical presentations to customer design, packaging, and system teams
• Collaborate with Sales, R&D, and manufacturing to align roadmaps with business goals
• Represent ASE at industry events, conferences, and forums to expand partnerships
• Advise internal stakeholders on customer trends and competitive positioning

Skills

Technical marketing

Strategic planning

Technical leadership

Customer engagement

Public speaking

Cross-functional collaboration

English fluency

Education

Bachelors/Masters/PhD in Engineering/Physics or related field

Tools

MS Office

Engineering simulation tools

Job description

SUMMARY: The primary goal of this position is to promote and drive market adoption, ecosystem leadership, and revenue growth of ASE's specific strategic technologies and advanced packaging platforms, including chiplet and package architectures, 2.5D/3D integration, heterogeneous integration, and system-in-package solutions, to global customers through engagement with customer engineers and technologists across their global organizations from IC design, package and system architects, manufacturing and market applications, as well as through conferences and industry forums. This position serves as the critical bridge between market demand and technology innovation, translating customer product roadmaps and industry trends into packaging technology strategies and business opportunities through deep technical dialogue, early-stage architecture influence, and ecosystem collaboration.

Working in close partnership with Sales, Factory engineering, and R&D teams, the Director aligns customer requirements with technology development roadmaps and ASE's packaging innovation strategy. Advise ASE factory engineering teams on technology innovations and technology qualifications in collaboration with foundry partners, equipment suppliers, materials providers, and industry consortia to strengthen ASE's leadership in heterogeneous integration technology. The ultimate objective is to represent ASE in industry forums, conferences, and consortia to expand strategic customer partnerships and translate advanced packaging technology leadership into sustained revenue growth and market differentiation.

ESSENTIAL DUTIES AND RESPONSIBILITIES include the following: other duties may be assigned. The Director, Engineering & Technical Marketing, is responsible for the promotion of strategic technology platforms to global customers. This role provides technical leadership in engagements with customer engineering organizations, including design, technology, and product development. The Director works closely with ASE factory engineering, R&D, and Sales to align customer technology requirements with ASE development roadmaps and business growth objectives.

The successful candidate must be a persuasive communicator capable of engaging both technical and business audiences within ASE as well as external partners, customers, and industry professionals. The role includes representing ASE at industry events, conferences, and technical forums to promote ASE's capabilities, technology leadership, and competitive advantages.

Other responsibilities include:

• Develop technology and service promotion strategies with key customers by understanding their business drivers, IC applications, system architectures, and market positions
• Create technical marketing materials (presentations, white papers, and technical briefings) to effectively communicate ASE's capabilities and technology differentiation
• Deliver technical presentations and engage with customer design, packaging, and system teams to promote and position ASE's technologies for next-generation products
• Collaborate with ASE application engineering and Sales to promote ASE's technical capabilities, roadmaps, and manufacturing strengths
• Facilitate communication between customers and internal engineering teams to address technology gaps and support product deployment. Contribute to long-term roadmap development with ASE manufacturing and R&D organizations
• Advise internal stakeholders on customer technology trends, competitive positioning, and key technical issues
• Drive technology engagements that lead to new business opportunities and design wins, increasing adoption of ASE's strategic platforms
• Support executive management in shaping long-term advanced packaging technology and business strategies

EDUCATION and/or EXPERIENCE: ASE prefers candidates with a Bachelor's, Master's, or Ph.D. in Electrical, Materials, Mechanical, or Chemical Engineering, Physics, or a related field, with 12+ years of semiconductor industry experience, preferably in semiconductor packaging or advanced packaging technologies.

Candidates should have experience managing strategic customer accounts and strong verbal, written, and interpersonal communication skills. The role requires the ability to deliver technical presentations, develop customer proposals, and provide structured progress reports. Strong organizational and computer skills are required.

• Proven ability to analyze technology and market trends to define and execute short-term and long-term business strategies
• Strong understanding of semiconductor device physics, packaging technologies, and manufacturing processes, including flip chip, bumping, 2.5D/3D, high-density fan-out, and silicon photonics integration
• Familiarity with emerging trends such as chiplet integration, advanced interconnects, substrate innovations, electrical and thermo-mechanical performance optimization, and advanced manufacturing processes
• Knowledge of packaging reliability, defect analysis, and qualification processes
• Experience in package development, architecture planning, and SI/PI performance analysis at package and PCB system levels
• Experience with DOE methodologies, BOM development, and thermo-mechanical assessments
• Working knowledge of engineering simulation tools (e.g., FEA, HFSS, CFD, Cadence APD) is a plus
• Proven strong ability to work independently and collaborate effectively with customers, vendors, and internal teams to develop and support advanced packaging technologies
• Active participation in industry networks or professional societies is highly desirable

GENERAL QUALIFICATIONS: To perform this job successfully, an individual must be able to perform each essential duty satisfactorily and demonstrate flexibility and adaptability in a dynamic environment. The requirements listed above are representative of the knowledge, skills, and abilities required. Reasonable accommodations may be made to enable individuals with disabilities to perform the essential functions. The successful candidate should demonstrate:

• Excellent written and verbal communication skills
• Strong teamwork and collaboration capabilities
• Ability to quickly learn new technologies and industry developments
• Ability to follow directions while also working independently
• Strong organizational and problem-solving skills

SUPERVISORY RESPONSIBILITIES: This position should have supervisory skills.

COMMUNICATION SKILLS: Excellent written and verbal communication skills are required. The candidate must be comfortable communicating with both technical and business audiences. Fluency in English is required. Mandarin proficiency is a plus

COMPUTER/SOFTWARE SKILLS/KNOWLEDGE: Proficient in MS Outlook, Word, Excel, and PowerPoint

MATHEMATICAL SKILLS: Must have basic math skills.

TRAVEL: This position requires both domestic and international travel

REASONING ABILITY: The candidate must be capable of working independently, analyzing complex technical and business situations, and making sound decisions to support technology development and customer engagement strategies

PHYSICAL DEMANDS: The physical demands described here are representative of those required to successfully perform the essential functions of this job. Reasonable accommodations may be made to enable individuals with disabilities to perform these functions

WORK ENVIRONMENT: The work environment characteristics described here are representative of those encountered while performing the essential functions of this job. Reasonable accommodations may be made to enable individuals with disabilities to perform these functions.

COMPANY BENEFITS: ASE (U.S.) INC. provides a comprehensive benefit package to all its full-time employees: Medical, Dental, Vision, Prescription, Flex Plan & Life Insurance. Eligibility for enrollment in our 401(k) Plan after successfully completing your 90-day introductory period

We are an equal opportunity employer. All applicants will be considered for employment without attention to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran status, or disability status.