DIRECTOR, CHIPLETS/FCBGA BU

Semiconductor Engineering; Tempe (AZ); Hybrid; USD 110,000 - 150,000; Full time

Job summary

Amkor seeks an experienced BU Product Manager for Advanced Chiplets/FCBGA packaging in Tempe, AZ. The role centers on program management and core customer account leadership, coordinating internal teams and supplier development to qualify and ramp production.

You will drive process development and cost analysis for NPIs while supporting existing customers. The ideal candidate has a strong background in semiconductor packaging, DOE/SPC experience, and proven project management skills, with the

Qualifications

• Bachelor’s degree in Engineering (Mechanical, Chemical, Electrical, Industrial, Materials Science or other relevant disciplines).
• 10+ years of demonstrated industry experience required, with semiconductor packaging experience required.
• Experience with Design of Experiments and Statistical Process Control is needed.
• Previous project management experience is a required.
• Knowledge of material and package characterization data analysis, test methods and qualification procedures are required.
• Strong understanding of wafer bump, fanout, assembly processes and techniques is necessary.
• Experience with cost modeling, pricing, quoting activities and products is needed.
• Proven ability to multiplex across numerous programs and teams is essential.

Responsibilities

• Partner with BU members to achieve annual goals, while managing customer relationships to grow market share.
• Promote Amkor package technologies directly to new and existing customers to find potential applications, deploying the flip chip package portfolio with key customers to gain business.
• Work closely with customer teams to understand the assembly, reliability and scheduling requirements for various new package configurations and product introductions.
• Create detailed package/process risk assessments for the manufacturability and reliability of NPIs, including highlighting areas of customer requirements that drive cost and implementing mitigation plans to control them.
• Work closely with customer package engineering and Amkor factory engineering to understand/characterize prototype build plans; enabling successful qualifications and robust, on-time manufacturing production ramps.
• Create and maintain detailed cost analysis on package types, process flows, and customer product RFQs as well as provide detailed pricing inputs to Management and Sales on customer package engineering programs.
• Work with Amkor advanced product development teams on the transfer of new packaging technologies to production.
• Work within the team to foster the development of product roadmaps, marketing strategies and business plans for continued growth in both existing and emerging markets.

Skills

Program management

Key account management

Customer relations

Semiconductor packaging

Cross-functional leadership

Microsoft Office

Design of Experiments

Statistical Process Control

Project management

Education

Bachelor’s degree in Engineering

Master’s degree is a plus

Tools

MS Office

Job description

Position Summary

Amkor is recruiting for a Business Unit (BU) Product Management position for Advanced Chiplets/FCBGA Packaging in Tempe, AZ, where the primary function of this position is program management and to manage key customer accounts. Additionally, the position will drive internal process development and co-development programs in support of customers, off-shore factories and supplier development teams while supporting the qualification and mass production of Chiplets/FCBGA products. This individual will manage multiple day-to-day activities through internal management systems, as well as support existing customers.

Essential Duties And Responsibilities

• Partner with BU members to achieve annual goals, while managing customer relationships to grow market share.
• Promote Amkor package technologies directly to new and existing customers to find potential applications, deploying the flip chip package portfolio with key customers to gain business.
• Work closely with customer teams to understand the assembly, reliability and scheduling requirements for various new package configurations and product introductions. To include: substrate design, silicon to package interconnects, product assembly material selections, and manufacturing process requirements.
• Create detailed package/process risk assessments for the manufacturability and reliability of NPIs, including highlighting areas of customer requirements that drive cost and implementing mitigation plans to control them.
• Work closely with customer package engineering and Amkor factory engineering to understand/characterize prototype build plans; enabling successful qualifications and robust, on-time manufacturing production ramps. This will include assisting the team in designing experiments, analyzing factory build data, supporting root cause failure analysis investigation, and managing corrective action pathways to resolution.
• Create and maintain detailed cost analysis on package types, process flows, and customer product RFQs as well as provide detailed pricing inputs to Management and Sales on customer package engineering programs.
• Work with Amkor advanced product development teams on the transfer of new packaging technologies to production. This will include supporting cost analysis, CapEx requirements, manufacturability assessments, and program management through final qualification and initial production ramp.
• Work within the team to foster the development of product roadmaps, marketing strategies and business plans for continued growth in both existing and emerging markets.

Required Qualifications

• This position requires a Bachelor’s degree in Engineering (Mechanical, Chemical, Electrical, Industrial, Materials Science or other relevant disciplines). Master’s degree is a plus.
• 10+ years of demonstrated industry experience required, with semiconductor packaging experience required.
• Experience with Design of Experiments and Statistical Process Control is needed.
• Previous project management experience is a required.
• Knowledge of material and package characterization data analysis, test methods and qualification procedures are required.
• Strong understanding of wafer bump, fanout, assembly processes and techniques is necessary.
• Experience with cost modeling, pricing, quoting activities and products is needed.
• Proven ability to multiplex across numerous programs and teams is essential.
• Experience working with offshore factories is a plus.
• Demonstrated self-drive and motivation to adapt and overcome obstacles across a multi-faceted, dynamic, and fast-paced environment.
• Ability to work independently in a heavily matrixed organization.
• Requires excellent, demonstrated written and verbal communication skills.
• Ability to work independently, solve problems, resolve barriers to success is a must.
• Proficiency with Microsoft Office (Excel, PowerPoint, Outlook) is required.
• This position can require up to 10% travel.

Preferred Qualifications

• Flip Chip package design and OSAT experience will be a plus.
• Experience working with external customers is highly preferred.

Location

Tempe, AZ. This position has a hybrid schedule. Candidates must reside near the local Amkor office or be willing to relocate to be considered.

Amkor is proud to be an Equal Opportunity Employer. We do not discriminate on the basis of race, color, ancestry, national origin, religion or religious creed, mental or physical disability, medical condition, genetic information, sex (including pregnancy, childbirth, and related medical conditions), sexual orientation, gender identity, gender expression, age, marital status, military or veteran status, citizenship, or other characteristics protected by state or federal law or local ordinance.

Position Summary

Amkor is recruiting for a Business Unit (BU) Product Management position for Advanced Chiplets/FCBGA Packaging in Tempe, AZ, where the primary function of this position is program management and to manage key customer accounts. Additionally, the position will drive internal process development and co-development programs in support of customers, off-shore factories and supplier development teams while supporting the qualification and mass production of Chiplets/FCBGA products. This individual will manage multiple day-to-day activities through internal management systems, as well as support existing customers.

Essential Duties And Responsibilities

• Partner with BU members to achieve annual goals, while managing customer relationships to grow market share.
• Promote Amkor package technologies directly to new and existing customers to find potential applications, deploying the flip chip package portfolio with key customers to gain business.
• Work closely with customer teams to understand the assembly, reliability and scheduling requirements for various new package configurations and product introductions. To include: substrate design, silicon to package interconnects, product assembly material selections, and manufacturing process requirements.
• Create detailed package/process risk assessments for the manufacturability and reliability of NPIs, including highlighting areas of customer requirements that drive cost and implementing mitigation plans to control them.
• Work closely with customer package engineering and Amkor factory engineering to understand/characterize prototype build plans; enabling successful qualifications and robust, on-time manufacturing production ramps. This will include assisting the team in designing experiments, analyzing factory build data, supporting root cause failure analysis investigation, and managing corrective action pathways to resolution.
• Create and maintain detailed cost analysis on package types, process flows, and customer product RFQs as well as provide detailed pricing inputs to Management and Sales on customer package engineering programs.
• Work with Amkor advanced product development teams on the transfer of new packaging technologies to production. This will include supporting cost analysis, CapEx requirements, manufacturability assessments, and program management through final qualification and initial production ramp.
• Work within the team to foster the development of product roadmaps, marketing strategies and business plans for continued growth in both existing and emerging markets.

Required Qualifications

• This position requires a Bachelor’s degree in Engineering (Mechanical, Chemical, Electrical, Industrial, Materials Science or other relevant disciplines). Master’s degree is a plus.
• 10+ years of demonstrated industry experience required, with semiconductor packaging experience required.
• Experience with Design of Experiments and Statistical Process Control is needed.
• Previous project management experience is a required.
• Knowledge of material and package characterization data analysis, test methods and qualification procedures are required.
• Strong understanding of wafer bump, fanout, assembly processes and techniques is necessary.
• Experience with cost modeling, pricing, quoting activities and products is needed.
• Proven ability to multiplex across numerous programs and teams is essential.
• Experience working with offshore factories is a plus.
• Demonstrated self-drive and motivation to adapt and overcome obstacles across a multi-faceted, dynamic, and fast-paced environment.
• Ability to work independently in a heavily matrixed organization.
• Requires excellent, demonstrated written and verbal communication skills.
• Ability to work independently, solve problems, resolve barriers to success is a must.
• Proficiency with Microsoft Office (Excel, PowerPoint, Outlook) is required.
• This position can require up to 10% travel.

Preferred Qualifications

• Flip Chip package design and OSAT experience will be a plus.
• Experience working with external customers is highly preferred.

Location

Tempe, AZ. This position has a hybrid schedule. Candidates must reside near the local Amkor office or be willing to relocate to be considered.

Amkor is proud to be an Equal Opportunity Employer. We do not discriminate on the basis of race, color, ancestry, national origin, religion or religious creed, mental or physical disability, medical condition, genetic information, sex (including pregnancy, childbirth, and related medical conditions), sexual orientation, gender identity, gender expression, age, marital status, military or veteran status, citizenship, or other characteristics protected by state or federal law or local ordinance.