Digital Failure Analysis Engineer (LFAB)

Texas Instruments; Lehi (UT); On-site; USD 80,000 - 120,000; Full time

Job summary

Texas Instruments is looking for a skilled Digital Failure Analysis engineer to join their team in Lehi, Utah. In this role, you will be responsible for performing root cause analysis on complex semiconductor failures, including VLSI designs and collaborating closely with different teams to enhance product yield.

The ideal candidate will possess a strong problem-solving mindset and experience with silicon debug techniques. Join Texas Instruments to be part of an innovative team at the forefront of semiconductor manufacturing.

Qualifications

• Experience in Digital Failure Analysis and problem-solving.
• Knowledge of VLSI designs and silicon debug techniques.
• Ability to collaborate cross-functionally with design and engineering teams.

Responsibilities

• Perform root cause analysis on complex failures.
• Conduct deep-drill analysis on VLSI designs.
• Collaborate with cross-functional teams to improve yield.

Job description

Join the Revolution in Semiconductor Manufacturing at LFAB!

Texas Instruments is seeking a skilled Digital Failure Analysis (FA) engineer to join their team in Lehi, Utah. We're at the forefront of an exciting era of growth and innovation at LFAB (Lehi Fab), where our state‑of‑the‑art 300mm, 65nm, 45nm and 28nm analog and embedded wafer manufacturing facilities are driving production of a diverse semiconductor portfolio in the heart of the Silicon Slopes.

Responsibilities

• Digital FA & Root Cause Analysis: Approach complex failures with a passion for problem‑solving and a mindset that pushes boundaries to innovate beyond standard procedures. Convert failing silicon into actionable root cause by integrating test and characterization data, DFT‑enabled observability, volume scan diagnosis, and targeted physical analysis (such as emission microscopy). Leverage ATPG‑generated test vectors and scan diagnostics to systematically isolate failure mechanisms. Bridge design, test, and manufacturing to rapidly enable corrective action across yield, quality, and product development.
• VLSI & Silicon Debug: Perform deep‑drill analysis on VLSI designs to understand digital circuitry behavior, timing interactions, and failure modes. Apply silicon debug techniques to correlate electrical characterization with design netlist and layout, supporting both design verification and production silicon analysis. Demonstrate an ability to think outside the box when standard diagnostic paths are exhausted.
• Cross‑functional Collaboration: Act as a key technical bridge through proactive collaboration across the organization. Work closely with Design teams on verification, Test engineers on diagnostic accuracy, and Physical FA specialists to correlate electrical failures with physical defects. Liaise with business units' product engineers and fab process engineers to improve yield based on Digital FA findings. Interface with EDA tool experts and design automation teams to optimize DFT coverage and diagnostics.
• Product Engineering: A small portion of the role (10‑20%) will entail product ownership where you will conduct thorough analysis of production yield issues to identify root causes, implement corrective actions, and collaborate with Business Units to characterize, qualify, and successfully release new products to production.