DDR Bench Characterization Engineer

Socket.dev; San Diego (CA); On-site; USD 94,000 - 141,000; Full time

Job summary

Qualcomm Technologies, Inc. in San Diego seeks an engineer to define and execute test methodologies for high‑speed memory subsystems, including LP-DDR and PC‑DDR for leading‑edge SOCs.

You will develop characterization plans, automate data collection, and drive silicon bring‑up and debug with cross‑functional teams to ensure electrical compliance and robust performance.

Qualifications

• Bachelor's degree required in CS/EE or related field.
• Master's degree preferred in EE/CE or related field.

Responsibilities

• Define and execute test methodologies and characterization for LP-DDR & PC-DDR subsystems.
• Develop and automate test scripts, measurement procedures, and data processing flows.
• Collaborate with IC Design, Systems Engineering, and Customer Eng. for bring-up and debug.

Skills

Python

C#

Test automation

English fluent

Problem solving

Communication

Education

Bachelor's degree in Computer Science, Electrical/Electronics Engineering, or related field

Master's degree in Electrical/Computer Engineering or related field

Tools

Oscilloscopes

TDRs/VNAs

J-BERT

Job description

Company:

Qualcomm Technologies, Inc.

Job Area:

Engineering Group, Engineering Group > Hardware Engineering

General Summary:

This position is for thePost Silicon Engineeringgroup that develops test solutions for highly integrated SOCs (System on Chip). Main responsibilitiesincludedefining and executing the development of Test methodologies and characterization ofleading-edgeLP-DDR & PC-DDRSubsystem components (DRAM, DRAM Controller,Mixed Signal PHY IP, IOcircuits and termination networks, Clocking architecture, Delay circuits,Power Distribution Network) as well as other proprietaryinterfaces.Responsibilitiesincludedeveloping and executing characterization plansfor HighSpeed IPsto optimize design parameters andvalidateelectrical compliance, driving corresponding first silicon bring-up & debug to qualify designs fabricated at external foundries. This role requires performing parametric analysis of silicon behavior over various operating process, voltage and temperature conditions and configurations, and driving root‑cause failure analysis to closure for design, test, or system‑level issues.This position also involves developingand automatingtest scripts, measurement procedures, anddata processingflows to accelerate silicon evaluation, improve turnaround time, and enable data‑driven decision‑making during bring‑up and characterization phases. The engineer will contribute to guard‑banding strategies and characterization sign‑off to support downstream manufacturing readiness. Engineerwill alsoassistin HW design and debug power integrity (PI) andsignalintegrity (SI) issues related to package and board design. Engineer Will be working closely with cross‑functional teams such as IC Design, Systems Engineering for chip/circuit bring -up, debug and feature enablement.The role also requires close collaboration with Customer Engineering and Hardware Applications teams to resolve customer issues/RMAdebugin a time‑critical environment including providing clear debug analysis, technical recommendations, and design feedback.

This position is ideal for engineers who excel in silicon debug,high-speedinterface analysis, anddata-drivenoptimization of complexmixed signalsystems and who are motivated to drive issues to closure across cross‑functional teams. The individual selected for the position should be passionate about delivering quality work products, seek to continually learn about new products as well as essential knowledge of industry trends, competitor products, and advances in various engineering fields from publicly available information and assist in conducting specialized analyses (e.g., feasibility studies, signal integrity, teardown analyses).

Minimum Qualifications:

• Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field.

Preferred Qualifications

• English fluent (>95% verbal and written).


• Work Experience: 1-3+yearsof experience in related areas. (fresh graduates welcome toapply)


• Experience with Python/C#for test automation isrequired


• Master's Degree in Electrical/Computer Engineeringor related field.


• Strong understanding of VLSI technologies,CMOS analog and digital integrated circuits, mixed-signaland semiconductor physics.


• Knowledge ofHigh-Speedtest and characterizationincluding eye diagram characteristics, differential signals,jitter analysis, signal integrityetc.is preferred.


• Familiarity with DDR 2/3/4/5, LPDDR 2/3/4/5 protocol,interface, IO receiver/transmitter,timingdiagramsand device specifications is a plus.


• Hands-on experience with lab equipment such as Oscilloscopes, TDRs/VNAs, J-BERTetc. and power measurement toolsis preferred.


• Familiarity withBoard Designconcepts (Schematic reviews, Layout best practicesetc.) is a plus.


• Strong ASIC device level characterization skills. System level knowledge is a plus.


• Knowledge in test automation development/scripting/debugging is a plus.


• Strong verbal and written communications skills as well as good organization and documentation skills.


• Strong problem solving & debugging skills. Ability to work independently and with good initiative to overcome technical challenges.


• Strong Interpersonal and teamwork skills with proven ability to work effectively in a fast-paced multi-disciplinary environment.


• Ability to document characterization results, debug findings,methodologyupdates, and design recommendations with clarity and technical rigor.


• Able to work independently and with good initiative to overcome technical challenges.Meetingprojectdeadlinesandcharacterization (char) milestones would berequired.


• Strong verbal and writtencommunicationsskills.Effective communicationwithin and outside the team is essential. Clear, data-driven analysis and preparing high quality reports, and presenting them effectively to internal stakeholders across teamsisrequired.Able to organize effectively and document work thoroughly while working with local andremote teamincluding debugfindings,methodologyupdates, and design recommendations with clarity and technical rigor.

Minimum Qualifications

• Bachelor's degree in Computer Engineering, Electrical/Electronics Engineering or related field and1+ years in Hardware engineering or related work experience


• Master's degree in Computer Engineering, Electrical/Electronics Engineering or related field.

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Pay range and Other Compensation & Benefits:

$94,200.00 - $141,200.00

The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer – and you can review more details about our US benefits at this link.

If you would like more information about this role, please contact Qualcomm Careers.