Component Engineering Technical Leader

Dormont Manufacturing Co; United States; On-site; USD 90,000 - 120,000; Full time

Job summary

Dormont Manufacturing Co is seeking an experienced thermal technology expert to develop and lead the thermal technology roadmap, focusing on innovative liquid cooling solutions for hardware. Candidates should have over 10 years of experience in design and testing of thermal solutions for electronic devices.

The role requires engagement with external vendors and contribution to analytical models using computational tools. A BS in Mechanical or Chemical Engineering is required, with extensive experience in cooling technologies.

Qualifications

• 10+ years’ experience in design, simulation, and testing of thermal solutions for electronic devices.
• Extensive experience with advanced air-cooling technologies.
• Experience with liquid cooling and/or immersion cooling.

Responsibilities

• Develop and lead system thermal technology roadmap.
• Investigate innovative liquid cooling solutions for hardware systems.
• Engage with external vendors on design, test, and production.
• Contribute to analytical models using Computational Fluid Dynamics.

Skills

Troubleshooting and thermal validation

Excellent communication skills

Project management skills

Metrics design skills

Education

BS in Mechanical/Thermal or Chemical Engineering

Tools

Data acquisition systems

Computational Fluid Dynamics tools

Job description

What You Will Do

• Develop and lead system thermal technology roadmap in partnership with microelectronics packaging suppliers, thermal interface material suppliers, cooling solution providers and internal partners to meet Cisco products’ needs.
• Develop quality strategy for liquid cooling manufacturing process.
• Investigate innovative liquid cooling solutions for hardware systems in large scale.
• Derive the tradeoffs in thermal performance of different package design elements (substrate, underfill, thermal interface material, heat spreader etc.) and chip thermal gradients from experimental test data.
• Develop test plans and qualification requirements to ensure mechanical and manufacturing adaptability of thermal cooling solutions (pumps, heat pipes, vapor chambers, heat sinks, liquid cooling etc.).
• Engage with external vendors including ODM and component vendors on design, test and production.
• Develop and publish case studies/technical papers describing thermal analysis of cooling systems.
• Establish the parameters for thermal design/testing, correlation of design/test results to model predictions.
• Contribute to analytical and numerical models using various Computational Fluid Dynamics tools to simulate and analyze different device level cooling schemes.
• Drive supplier ecosystem development, and participate in industry consortia, conferences and collaborate with academia and other strategic partners to develop new methodologies and influence Cisco’s position in the industry.
• Integrate Circuit Thermal simulation and testing and system level cooling technologies.
• Mechanical design validation and testing for electronic assemblies.
• Coordinate Circuit Packaging technologies (BGA, large body size Flip Chip BGA, 2.5D and 3D Packaging).
• Component and system reliability analysis.

Who You Will Work With

The Component Quality and Technology Organization in Supply Chain Operations is a key hub of technical innovation in Cisco. Members of the organization have a broad scope of influence: interacting with Business Units, Product Operations, Manufacturing Operations, Planning and Fulfillment, Supplier Management and directly with Suppliers. In addition, members of the organization participate in industry consortia, conferences and collaborate with academia and other strategic partners. The organization focuses on evaluating and adopting new component technologies to help Cisco leapfrog the competition in sophisticated algorithms and solutions to solve complex problems.

Who You Are

• Experience with troubleshooting and thermal validation with data acquisition systems, airflow, and environmental chambers. Familiar with manufacturing process for key liquid cooling components.
• Ability to lead by influence without direct reporting chain and advise executive decision makers.
• Self‑starter, consistent record to work independently on multiple projects and priorities.
• Ability to think quickly, respond to changing demands, anticipate future problems, and recommend preventative courses of action.
• Excellent communication, project management and metrics design skills.
• Ability to create presentations for diverse audiences and varying executive levels to support agile decision‑making.

Minimum Qualifications

• BS in Mechanical/Thermal or Chemical Engineering.
• 10+ years’ experience in design, simulation, and testing of thermal solutions for electronic devices and systems.
• Extensive experience with advanced air‑cooling technologies (vapor chamber and remote heat sinks, thermal interface materials, fans/fan trays).
• Experience with liquid cooling and/or immersion cooling.

Preferred Qualifications

• MS or PhD in Mechanical or Chemical Engineering or related field.
• 15+ years of relevant proven experience in microelectronics thermal cooling.
• Experience with JEDEC JESD 51 thermal testing standards.
• Experience with Thermal Interface Material Thermal Conductivity Testing procedures and microelectronics packaging design and manufacturing process.