Camera Module Design Architect

Apple Inc.; Cupertino (CA); On-site; USD 184,700 - 324,800; Full time

Job summary

Apple is seeking a highly skilled Camera Design Engineer Architect to lead the end‑to‑end electrical architecture for camera modules across its product portfolio. You will define power delivery networks, high‑speed interfaces, and control‑plane architectures to enable premier imaging performance in iPhone, iPad, Mac, Vision, and wearables.

The role requires deep expertise in mixed‑signal design, CMOS readout architectures, MIPI CSI‑2, and EMI/EMC considerations, with hands‑on involvement from

Qualifications

• BS degree in Electrical Engineering, Computer Engineering, or a related field.
• Experience in electrical architecture, mixed-signal design, or camera/imaging subsystem development for consumer electronics.
• Experience defining or designing camera subsystems including image sensor interfacing, actuator drivers, and low-noise power delivery on rigid PCB, flex, or SiP substrates.
• Experience with high-speed serial interface design (MIPI CSI‑2, D‑PHY, C‑PHY) including signal integrity analysis, channel simulation, and lab correlation.

Responsibilities

• Define end‑to‑end electrical architecture for camera subsystems, including sensor‑to‑SoC signal chain, MIPI CSI-2, ACI, ALPDP lane budgeting, clocking topology, reset/control sequencing, and multi‑camera synchronization schemes
• Architect power delivery networks for image sensors, actuators (VCM/OIS), and flash subsystems, including rail partitioning, PSRR budgeting, transient requirements, and low‑noise regulator selection
• Lead high‑speed interface design and signal integrity analysis for MIPI, ACI or ALPDP lanes, including channel budgeting, connector/flex selection, EMI mitigation, and pre/post‑layout SI/PI simulation
• Define schematic and PCB/flex layout guidelines for camera modules and system boards, including reference designs, layer stackup requirements, impedance targets, and DFM/DFT rules
• Drive cross‑functional architecture reviews with SoC ISP, PMIC, RF, mechanical, and optics teams to align on power budgets, thermal envelopes, form factor constraints, and testability requirements
• Partner with image sensor and actuator suppliers to influence next‑generation silicon roadmaps, review datasheets and errata, and negotiate interface, power, and reliability specifications
• Support EVT/DVT/PVT bring‑up and validation by leading debug of high‑speed link failures, power integrity issues, EMI/ESD events, and image‑quality‑linked electrical root causes
• Lead FACA investigations by developing electrical characterization methodologies and diagnostic strategies to identify root causes of camera subsystem failures across engineering builds and mass production
• Analyze electrical margin data, temperature/voltage corner sweeps, and yield signatures to drive design guardbands, screening strategies, and preventive design changes across product generations
• Maintain comprehensive architecture documentation including block diagrams, interface specifications, power state tables, timing diagrams, and compliance matrices
• Participate in design reviews with camera module, system board, and product design teams to ensure architectural integrity, testability, and validation coverage
• Interface with camera algorithm, ISP firmware, and system software teams to translate imaging use cases into concrete electrical architecture and power state requirements

Skills

Electrical architecture

Mixed-signal design

Camera subsystem development

High-speed interfaces (MIPI CSI-2, D-P

Signal integrity analysis

Power delivery networks

EMI/EMC considerations

Root cause analysis / debugging

Cross-functional collaboration

Documentation & specifications

Education

Bachelor's degree in Electrical Engineering or related field

Master's or PhD in Electrical Engineering or relevant field

Job description

Apple is seeking a highly skilled Camera Design Engineer Architect to lead the end‑to‑end electrical architecture for camera modules across its product portfolio. You will define power delivery networks, high‑speed interfaces, and control‑plane architectures to enable premier imaging performance in iPhone, iPad, Mac, Vision, and wearables.

The role requires deep expertise in mixed‑signal design, CMOS readout architectures, MIPI CSI‑2, and EMI/EMC considerations, with hands‑on involvement from