Business Development Manager- Emerging Growth Marketing

What’s Upstate; Durham (NC); On-site; USD 150,000 - 210,000; Full time

Job summary

Wolfspeed is seeking a Strategic Business Development Manager to accelerate entry and growth in the advanced packaging market across AI, HPC, CPO, photonics, quantum, and AR/VR.

This role focuses on SiC in 2.5D/3D packaging, identifying design-ins, forging ecosystem partnerships, and securing long-term engagements with chipmakers, foundries, OSATs, EDA players, photonics vendors, quantum hardware developers, and AR/VR device makers.

Qualifications

• Bachelor's degree in Electrical Engineering, Materials Science, or related technical field.
• 10+ years in business development, strategic partnerships, or sales within advanced semiconductor packaging or supply chain.
• Deep understanding of 2.5D/3D packaging, interconnect tech, and thermal management in AI/HPC systems.
• Ability to articulate SiC value to engineers and executives at foundries, OSATs, and chip designers.
• Proven track record securing strategic deals, joint programs, or long-term supply agreements.
• Exceptional negotiation and executive relationship-building skills.
• Willingness to travel globally.
• Experience creating strategic account plans aligned with business-unit strategy.
• Ability to qualify opportunities for SiC packaging materials across AI supply chains.
• Passion for growing a breakthrough, technically complex market.

Responsibilities

• Market Expansion: identify and develop new SiC opportunities in advanced packaging across AI/HPC, AR/VR, and related fields.
• Ecosystem Partnerships: build executive relationships with AI designers, foundries, OSATs, EDA vendors, and photonics suppliers.
• Strategic Growth Initiatives: drive co-development programs and design-in engagements across multiple use cases.
• Deal Structuring & Negotiation: lead contracts, licensing, and partnerships to balance growth and risk.
• Voice of Customer: align initiatives with packaging capabilities and platform requirements.
• Cross-Functional Leadership: coordinate with materials, technology, and applications teams.
• Market Intelligence: monitor competitors and AI hardware trends to shape strategy.

Skills

Strategic partnerships

Executive relationship building

Negotiation

Market expansion

Communication to execs

Education

Bachelor's degree in Electrical Engineering, Materials Science, or related field

Job description

We are looking for a Strategic Business Development Manager to accelerate Wolfspeed's entry and growth in the advanced packaging market across a broad and fast-evolving set of emerging platforms — including AI and high-performance computing (HPC), co-packaged optics (CPO) and silicon photonics, quantum computing, and augmented/virtual reality (AR/VR). This role will be a critical driver of our go-to-market strategy for SiC in 2.5D/3D packaging architectures — identifying design-in opportunities, forging ecosystem partnerships, and securing long-term engagements with chipmakers, foundries, OSATs, EDA players, photonics and optical-module vendors, quantum hardware developers, and AR/VR device makers. The ideal candidate combines a deep understanding of advanced semiconductor packaging with a strong commercial mindset, intellectual curiosity about adjacent and nascent applications, and a proven track record of building high-value relationships across the AI chip, photonics, quantum, and immersive-computing supply chains.

The ideal candidate will be located in the San Francisco Bay Area or Phoenix, Arizona.

Key Responsibilities

• Market Expansion: Identify and develop new business opportunities for SiC in advanced packaging applications — including backside cooling layers, passive interposers, and active interposers — across a range of high-growth markets such as AI accelerators and HPC, co-packaged optics and optical I/O, quantum computing systems, and AR/VR platforms (e.g., compact high-density modules, optical engines, photonic interposers, and display driver integration for headsets and smart glasses). Remain open to additional emerging use cases where SiC's material properties create differentiated value.
• Ecosystem Partnerships: Build executive-level relationships with leading AI chip designers (e.g., hyperscalers, GPU/ASIC OEMs), foundries (e.g., TSMC), OSATs, EDA players, photonics/CPO and optical-module suppliers, quantum hardware developers, and AR/VR OEMs and silicon teams to secure design-ins, joint development programs, and long-term supply agreements.
• Strategic Growth Initiatives: Drive co-development programs and PDK-led engagements that embed SiC into customer packaging design flows across AI, HPC, co-packaged optics, quantum, and AR/VR use cases, converting material expertise into durable ecosystem lock-in.
• Deal Structuring & Negotiation: Lead strategic contracts, licensing, and partnership negotiations — balancing revenue growth, risk mitigation, and long-term scalability in nascent but fast-growing markets.
• Voice of Customer: Work closely with materials, technology development, and applications engineering teams to align growth initiatives with SiC process capabilities and packaging integration requirements across data center, photonics, quantum, and immersive-device form factors.
• Cross-Functional Leadership: Work closely with materials, technology development, and applications engineering teams to align growth initiatives with SiC process capabilities and packaging integration requirements across data center and immersive-device form factors.
• Market Intelligence: Monitor competitor activities, foundry roadmaps, AI hardware trends, to shape business development strategy and positioning for SiC.

Qualifications

• Bachelor's degree in Electrical Engineering, Materials Science, or related technical field.
• 10+ years of experience in business development, strategic partnerships, or sales within advanced semiconductor packaging, materials, or the semiconductor supply chain.
• Strong understanding of advanced packaging architectures (2.5D/3D, CoWoS, EMIB, Foveros, chiplet integration), interconnect technologies (TSV, TSiCV, RDL, hybrid bonding), and thermal management constraints in AI/HPC systems.
• Ability to communicate SiC's technical value proposition (thermal conductivity, mechanical robustness, RF performance) to both engineering and executive audiences at foundries, OSATs, and chip designers.
• Proven track record in securing strategic deals, joint development programs, or long-term supply agreements with global semiconductor customers.
• Exceptional negotiation, communication, and executive relationship-building skills.
• Willingness to travel globally.
• Experience developing strategic account plans for key accounts consistent with business unit strategies.
• Ability to qualify opportunities and determine fit for SiC packaging materials across the AI chip supply chain.
• Passion for building breakthrough growth in an emerging, technically complex market.

We are an equal opportunity employer and all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, national origin, disability status, protected veteran status, or any other characteristic protected by law.