Boise Wet Etch Process Engineer — Yield & Innovation

Micron Technology; Boise (ID); On-site; USD 90,000 - 130,000; Full time

Benefits offered by this job

Health insurance

Paid time off

Retirement plan

Job summary

Micron Technology in Boise, ID seeks a Wet Etch Process Engineer to lead start‑up, development, and optimization of DRAM wet etch processes. You will drive yield improvements, cost reduction, and productivity gains while collaborating with equipment and integration engineers to resolve production issues.

The role requires an engineering degree with 2+ years in semiconductor wet etch, plus strong analytical and teamwork skills to tackle complex manufacturing challenges in a fast‑paced environment.

Qualifications

• MS in Chemical Engineering or BS with 2+ years in Semiconductor industry experience as a Wet Etch process owner (vapor etch, dry strip, dry bevel etch & Cu plating in addition to conventional bath and spin processes)
• Good understanding of Agentic AI or willingness to learn Agentic AI to help develop efficient workflow
• Strong understanding of semiconductor fabrication processes and equipment

Responsibilities

• Start up, develop, and optimize Wet Etch processes for DRAM manufacturing.
• Drive yield improvements, cost reductions, and productivity improvements.
• Collaborate with equipment engineers and integration engineers to resolve production issues.
• Use project management skills to complete milestones addressing yield, defectivity, production, and cost gaps.
• Improve SPC charts and own process performance metrics.

Skills

Process ownership

Data analysis

Programming

Team collaboration

AI basics

Education

MS in Chemical Engineering

BS with 2+ years in semiconductor industry as Wet Etch owner

Job description

Micron Technology in Boise, ID seeks a Wet Etch Process Engineer to lead start‑up, development, and optimization of DRAM wet etch processes. You will drive yield improvements, cost reduction, and productivity gains while collaborating with equipment and integration engineers to resolve production issues.

The role requires an engineering degree with 2+ years in semiconductor wet etch, plus strong analytical and teamwork skills to tackle complex manufacturing challenges in a fast‑paced environment.