BIM Engineer - Semiconductor Fab Design & Coordination

TSMC - Taiwan Semiconductor Manufacturing Company Limited; Phoenix (AZ); On-site; USD 70,000 - 100,000; Full time

Benefits offered by this job

Medical, Dental, and Vision Plans

Income-Protection Programs

401(k) Retirement Savings Plan

Paid Time-Off

Job summary

TSMC Arizona is seeking a BIM Engineer to design and optimize semiconductor FAB projects using cutting-edge BIM tools. You will create precise 3D models, manage space for tool layouts, and ensure compliance across global FAB expansions.

The role requires collaboration with Facility engineers, ISEP, IT, and AMHS teams, with international travel as needed. A bachelor’s degree in a related field and 1–3 years of modeling experience are preferred.

Qualifications

• Bachelor's degree in Civil, Mechanical or related field is required.
• 1–3 years modeling experience, or at least 1 year in semiconductor construction.
• Proficiency in BIM software including Revit, AutoCAD, Navisworks, Bluebeam.

Responsibilities

• Design and optimize semiconductor FAB projects using BIM tools.
• Create accurate 3D models and manage tool layouts.
• Coordinate with Facility engineers, IT, and AMHS across global FAB expansions.

Skills

Revit

AutoCAD

Navisworks

Bluebeam

Team collaboration

Education

Bachelor's degree in Civil/Mechanical Engineering

Master's degree (preferred)

Tools

Autodesk Revit

AutoCAD

Navisworks

Bluebeam

Job description

TSMC Arizona is seeking a BIM Engineer to design and optimize semiconductor FAB projects using cutting-edge BIM tools. You will create precise 3D models, manage space for tool layouts, and ensure compliance across global FAB expansions.

The role requires collaboration with Facility engineers, ISEP, IT, and AMHS teams, with international travel as needed. A bachelor’s degree in a related field and 1–3 years of modeling experience are preferred.