ASIC RF Sensor Engineer — Next-Gen Chips (Remote)

Air Force Research Laboratory

Dayton (OH)

Hybrid

USD 75,000 - 119,000

Full time

4 days ago
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Job summary

Air Force Research Laboratory in Dayton, OH seeks an ASIC Engineer to advance RF sensor capabilities by developing next-generation ASICs for microelectronic components and advanced packaging. You will lead domain-specific programs, coordinate with multiple teams, and contribute to Air Force acquisition programs.

Responsibilities include design, verification, test planning, and collaboration with cross-functional teams to ensure successful integration and transition to Air and Space platforms.

Qualifications

  • Top Secret with SCI/SAP clearance eligibility.
  • 1+ year of specialized experience at DR-01 or equivalent in RF, digital, and mixed signal design.
  • APDP Level/Tier 2 Non-Critical certification in Engineering and Technical Management (N) with 60 months to meet requirements.

Responsibilities

  • Designing and developing specialized digital and mixed-signal circuits for military applications.
  • Analyze and optimize designs balancing performance, power, size and cost.
  • Develop and execute test plans including simulations and verification.
  • Oversee data collection to support R&D initiatives.
  • Provide technical oversight for Air Force-sponsored efforts.
  • Collaborate with architects, verification, physical design, and software teams.

Skills

RF design
Digital design
Mixed-signal design
SystemVerilog
VHDL
MATLAB
Python
C/C++
Open Architecture standards
Team collaboration
Verbal communication

Education

Master's degree in Electrical/Computer Engineering

Tools

Cadence
Synopsys
Siemens EDA
UVM

Job description

Air Force Research Laboratory in Dayton, OH seeks an ASIC Engineer to advance RF sensor capabilities by developing next-generation ASICs for microelectronic components and advanced packaging. You will lead domain-specific programs, coordinate with multiple teams, and contribute to Air Force acquisition programs.

Responsibilities include design, verification, test planning, and collaboration with cross-functional teams to ensure successful integration and transition to Air and Space platforms.

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