Analog Hardware Engineer: CIM Compute & PCB Lead

Normal Computing

New York (NY)

On-site

USD 180,000 - 240,000

Full time

14 days+

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Job summary

Normal Computing is building silicon that turns thermal noise into a computational resource, redefining AI inference with CIM technology. You will own the end-to-end development of our CIM substrate—from architecture and schematic design to layout, tapeout, and post‑silicon bring‑up.

You will drive analog and PCB design, collaborating with ML engineers to optimize system-level PPA, while delivering robust silicon and boards for next‑gen LLM/diffusion workloads.

Qualifications

  • Experience in analog IP development from spec to GDSII, including tape-out and bring-up.
  • Experience with memory tech (SRAM/DRAM) at bitcell and array level.
  • Experience in schematic and layout of custom bitcells.
  • Fluency with Cadence flow: Virtuoso, Spectre, Assembler, Extraction, Layout.
  • PCB end-to-end ownership from design to fabrication and bring-up.

Responsibilities

  • End-to-end analog development flow: lead the full analog development cycle including research, exploratory design, and evaluation of CIM architectures
  • End-to-end PCB design flow: lead the full PCB development cycle including research, design, and evaluation of custom chips
  • Silicon bringup: lead post-silicon correlation and validation efforts including root‑cause analysis and general debug
  • PCB bringup: ensure the PCB you designed and manufactured is fully functional as intended
  • Cross‑functional collaboration: work alongside analog, digital, and ML engineers to further improve system‑level PPA.

Skills

Analog IP design
Memory technologies (SRAM/DRAM)
Custom bitcell design
PCB end-to-end design
Reliability analysis (PVT/Monte Carlo)

Tools

Cadence tools (Virtuoso, Spectre, Assembler, Extraction, Layout)

Job description

Normal Computing is building silicon that turns thermal noise into a computational resource, redefining AI inference with CIM technology. You will own the end-to-end development of our CIM substrate—from architecture and schematic design to layout, tapeout, and post‑silicon bring‑up.

You will drive analog and PCB design, collaborating with ML engineers to optimize system-level PPA, while delivering robust silicon and boards for next‑gen LLM/diffusion workloads.

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