AI Server Thermal Engineer - Liquid-Cooling & Validation

Foxconn-Pce-Technology; Santa Clara (CA); On-site; USD 125,000 - 155,000; Full time

Job summary

Foxconn is seeking an AI Server/Rack Thermal Engineer in Santa Clara, CA, to own the thermal validation, cooling optimization, and fluid-dynamics testing for high-density AI racks. You will ensure safe operation under peak compute loads with advanced liquid-cooling hardware and CDU systems.

The role requires hands-on validation, profiling, and collaboration with firmware and hardware teams to deliver robust thermal performance across the product lifecycle.

Qualifications

• BS in Mechanical/Aerospace Engineering with specialization in thermodynamics, fluid mechanics, and heat transfer.
• 2+ years of Liquid Cooling & Fluid Dynamics Testing.
• 2+ years of Full-System Thermal Validation & Hardware Stress Testing.
• 1+ year of Thermal Failure Analysis & Instrumentation.
• 1+ year of BMC / BIOS Telemetry & Control Tuning.

Responsibilities

• Validate liquid cooling performance by monitoring coolant flow, temperature, pressure, and telemetry data.
• Conduct thermal profiling and burn-in testing under high workloads.
• Investigate thermal failures and hotspots to determine root causes and corrective actions.
• Calibrate cooling-control parameters (fan-speed curves, pump controls, temperature thresholds).
• Document changes and coordinate with R&D, NPI, manufacturing, quality, and other teams.

Skills

Liquid Cooling

Thermal Validation

Telemetry Analysis

System Thermal Tuning

Education

Bachelor of Science in Mechanical/Aerospace Engineering (thermodynamics/fluids/heat transfer)

Tools

Coolant Distribution Units (CDUs)

Direct-to-Chip Water Blocks

Job description

Foxconn is seeking an AI Server/Rack Thermal Engineer in Santa Clara, CA, to own the thermal validation, cooling optimization, and fluid-dynamics testing for high-density AI racks. You will ensure safe operation under peak compute loads with advanced liquid-cooling hardware and CDU systems.

The role requires hands-on validation, profiling, and collaboration with firmware and hardware teams to deliver robust thermal performance across the product lifecycle.