AI Power Package Architect for HPC Modules

Infineon Technologies AG; Andover (MA); On-site; USD 156,900 - 215,700; Full time

Job summary

Infineon Technologies AG in Andover, MA, seeks qualified professionals to develop AI power supply packages for high-performance computing modules. The role involves defining package concepts, validating them through simulations, and collaborating with development teams.

The ideal candidate has a technical background with a physics or electronics degree and at least 6 years of experience in assembly technologies. The compensation ranges from $156,900 to $215,700 per year.

Qualifications

• 6 years practical experience in assembly technologies.
• Detailed knowledge of Back End processes and materials.
• Background knowledge of SMT related technologies.

Responsibilities

• Define package concepts for AI power supply products.
• Validate package concepts through simulation and hardware demonstrators.
• Align new ideas and concepts with Back End development.

Skills

Assembly technologies

Package design tools (e.g. AutoCAD/Cadence)

Communication skills

Market analysis

Back End processes and materials

Education

Degree in Physics or Electronics

Tools

AutoCAD

Cadence

Job description

Infineon Technologies AG in Andover, MA, seeks qualified professionals to develop AI power supply packages for high-performance computing modules. The role involves defining package concepts, validating them through simulations, and collaborating with development teams.

The ideal candidate has a technical background with a physics or electronics degree and at least 6 years of experience in assembly technologies. The compensation ranges from $156,900 to $215,700 per year.