AI-Driven Package Design Methodology Engineer

NVIDIA AI

Santa Clara (CA)

On-site

USD 136,000 - 265,000

Full time

14 days+

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Benefits offered by this job

Equity
Benefits package
Competitive salaries

Job summary

NVIDIA's Advanced Package Engineering team is expanding to deliver production-grade tooling for next-generation AI and HPC package designs. This role involves building flows and workflows for silicon and substrate design, collaborating with top engineers to optimize production and enable scalable packaging solutions.

You’ll apply Python and C++ skills, leverage AI/ML in engineering workflows, and contribute to state-of-the-art EDA tooling, ensuring high-quality design processes across multiple

Qualifications

  • BS in Computer Science, Electrical Engineering, or related field (or equivalent experience), and 5+ years of flow and methodology development experience building flows for package design used by engineering teams at scale.
  • Good programming fundamentals in Python and/or C++, including proficiency with data structures, algorithms, object-oriented design, and code quality practices.
  • Demonstrated experience applying AI/ML techniques in engineering workflows — this could include using LLMs for code generation and debugging, building ML-assisted design analysis tools, or integrating AI-assisted flows into EDA environments.
  • Strong understanding of electrical engineering fundamentals relevant to VLSI package design (signal integrity, power delivery, parasitic extraction, or equivalent).

Responsibilities

  • Work with world-class engineers to design and implement VLSI tools for silicon and substrate design.
  • Develop applications to enable project engineers with an emphasis on maintainability and ease of use.
  • Develop flows/tools and methodologies to construct, analyze, and validate package designs at many different stages in the production flow.
  • Optimize the daily workflows of the world’s top package designers.

Skills

Python
C++
Data structures
Algorithms
OO design
Code quality
AI/ML in workflows
LLMs for code generation

Education

BS in Computer Science, Electrical Engineering, or related field

Job description

NVIDIA's Advanced Package Engineering team is expanding to deliver production-grade tooling for next-generation AI and HPC package designs. This role involves building flows and workflows for silicon and substrate design, collaborating with top engineers to optimize production and enable scalable packaging solutions.

You’ll apply Python and C++ skills, leverage AI/ML in engineering workflows, and contribute to state-of-the-art EDA tooling, ensuring high-quality design processes across multiple

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