AI Data Center Power Architect: High-Current, Liquid-Cooled

BizLink Group; Fremont (CA); On-site; USD 180,000 - 240,000; Full time

Job summary

BizLink Group in Fremont, CA is seeking a Power Architect to define architecture for power connectors, liquid-cooled busbars, and AI server power delivery. You will drive performance, reliability, and scalability while aligning with IEC/IEEE and thermal standards.

Experience with high-current designs (130–3000A) and precision alignment is essential. You will collaborate with OEMs and chip vendors, contribute to roadmaps, and push innovations in liquid cooling and high-conductivity materials.

Qualifications

• Bachelor's degree in Electrical/Power related field.
• 10–15 years of experience in power architecture for high-density AI infrastructure.
• Experience with liquid-cooled power systems and 3,000A max currents.

Responsibilities

• Design and optimize power distribution systems for AI servers and racks, ensuring scalability and thermal efficiency.
• Focus on high-current applications (130–3,000A) and precise alignment to prevent GPU/TPU damage.
• Build and maintain power estimation models and tools for server and rack systems.
• Analyze performance versus power and support architectural exploration with hardware/software teams.
• Ensure designs meet IEC/IEEE standards and safety regulations including wide operating ranges.
• Collaborate with Sales, PLM and R&D to align roadmaps with AI infrastructure needs.
• Represent the org in industry consortia like OCP, OIF, IEEE to drive standardization.

Skills

Power architecture

High-current design

Thermal management

Cross-functional collab

IEC/IEEE standards

CAD tools

Power delivery

AI reference architectures

Education

Bachelor’s degree in Electrical/Power

Master’s/PhD in Power Mechanics/ Thermal/ Applied Physics

Tools

CAD tools

Power modelling tools

Job description

BizLink Group in Fremont, CA is seeking a Power Architect to define architecture for power connectors, liquid-cooled busbars, and AI server power delivery. You will drive performance, reliability, and scalability while aligning with IEC/IEEE and thermal standards.

Experience with high-current designs (130–3000A) and precision alignment is essential. You will collaborate with OEMs and chip vendors, contribute to roadmaps, and push innovations in liquid cooling and high-conductivity materials.