Aerospace Systems Test Intern (Avionics & C#)

AV; Virginia; On-site; USD 25,000 - 39,000; Full time

Benefits offered by this job

Relocation stipend

Housing reimbursement

Job summary

AeroVironment is offering a Summer Internship Program in the United States. The 12-week, on-site internship gives students hands-on experience in the aerospace and defense industry, working with AV teams on meaningful projects and software development in C# and related testing environments.

Applicants should be pursuing a B.S. in Electrical, Mechanical, Software Engineering or related fields, with a minimum 3.0 GPA and a willingness to relocate for housing/relocation stipends.

Qualifications

• Pursuing a bachelor’s degree in a related engineering/software field.
• 0–2 years of relevant academic or project experience (test development, lab, or manufacturing).
• Familiarity with bug reports and root-cause analysis.
• Exposure to Object-Oriented Programming (C# or LabVIEW a plus).
• Basic debugging and troubleshooting knowledge.

Responsibilities

• Assist design, development, deployment, troubleshooting, and upgrading of test equipment for PCBAs, subsystems, and AV systems.
• Support C# / OOP software development using Visual Studio.
• Help develop test software programs in C#.
• Collaborate to create test plans, collect requirements, and define test strategies.
• Analyze and format test results following standard procedures.

Skills

C# / OOP programming

Bug reports & root-cause analysis

Debugging & troubleshooting

Test equipment design

Cross-functional collaboration

Education

Pursuing a B.S. in Electrical, Mechanical, Software Engineering or related

Tools

Visual Studio

LabVIEW

Job description

AeroVironment is offering a Summer Internship Program in the United States. The 12-week, on-site internship gives students hands-on experience in the aerospace and defense industry, working with AV teams on meaningful projects and software development in C# and related testing environments.

Applicants should be pursuing a B.S. in Electrical, Mechanical, Software Engineering or related fields, with a minimum 3.0 GPA and a willingness to relocate for housing/relocation stipends.