3D Heterogeneous Integration Development Intern (Summer 2027)

GlobalFoundries inc.; Town of Malta (NY); Hybrid; USD 28.000 - 55.000; Vollzeit

Zusammenfassung

GlobalFoundries is seeking a 3D Heterogeneous Integration Development Intern for Summer 2027 in Malta, NY. You will contribute to advanced packaging and process-integration development, performing experiments, analyzing data, and supporting model development with mentorship and collaboration across multiple teams.

You'll work up to 40 hours per week, gain exposure to wafer-to-wafer and die-to-wafer bonding, TSV/TOV and interposer technologies, and participate in the internship program designed

Qualifikationen

• Sophomore year of study and pursuing a Bachelor’s or Master’s in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, or related field during the internship.
• Must maintain an overall GPA of at least 3.0 and be in good academic standing.
• English language fluency (written and verbal) required.
• Travel up to 10% and 40 hours per week commitment during the internship.

Aufgaben

• Plan and perform design of experiments (DOEs) using internal tooling and external partners.
• Analyze and interpret engineering data from experiments and process optimizations.
• Develop or support process models for advanced packaging and integration performance.
• Assist engineers with daily integration, documentation, and problem solving.
• Collaborate with cross-functional teams to support project objectives and summarize results.

Kenntnisse

English proficiency

Ausbildung

Bachelor’s or Master’s in Electrical/Mechanical/Chemical/Materials Science

Jobbeschreibung

## 3D Heterogeneous Integration Development Intern (Summer 2027)Apply: USA - New York - Malta: Full time: Posted Today: JR-2604433**About GlobalFoundries** GlobalFoundries (GF) is a leading manufacturer of essential semiconductors, enabling AI at scale from the cloud to the physical world. Through deep partnerships with customers, GF delivers differentiated, power-efficient and high-performance solutions for high-growth markets. GF is a trusted and holistic technology partner for customers around the world. GF’s talented, global team remains focused every day on security, longevity and sustainability. For more information, visit www.gf.com. **Internship Program Overview:** Our Interns & Co-ops are our entry-level talent pipeline for GF across the globe. Our goal is to provide students with a meaningful work experience that will equip them with the skills to embark on a career in the fast-paced and growing semiconductor industry after graduation. As an intern at GF, you’ll experience one-on-one mentorship, work assignments that prioritize your growth and potential, professional development opportunities, and the chance to network with executives. **Summary of Role:** The 3D Heterogeneous Integration Development Intern will contribute to advanced packaging and process-integration development, including wafer-to-wafer hybrid bonding, die-to-wafer hybrid bonding, through-silicon via/through-oxide via (TSV/TOV), and interposer technologies. The intern will work with engineering teams to conduct experiments, analyze technical data, model processes, and support daily integration and process-development activities. **Essential Responsibilities include:** * Plan and perform design of experiments (DOEs) using internal semiconductor tooling and equipment at external partners.* Analyze and interpret engineering data from experiments, process optimizations, and characterization activities.* Develop or support process models to improve understanding of advanced packaging and integration performance.* Assist engineers with daily integration, process-development, documentation, and technical problem-solving activities.* Collaborate with process, materials, equipment, characterization, and external partner teams to support project objectives.* Summarize experimental results and communicate technical findings and recommended next steps to project stakeholders. **Other Responsibilities:** * Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs. **Required Qualifications:** * Education – At least a sophomore at time of application and actively pursuing a Bachelor’s or Master’s in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, or related field through an accredited degree program during the time of internship.* Must have at least an overall 3.0 GPA and be in good academic standing.* Language Fluency - English (Written & Verbal)* Travel - Up to 10%* Ability to work at least 40 hours per week during the internship. **Preferred Qualifications:** * Prior related internship or co-op experience* Demonstrated prior leadership experience in the workplace, school projects, competitions, etc.* Strong interest in leveraging AI tools and emerging technologies to enhance productivity, streamline workflows, and support effective decision-making.* Project management skills, i.e., the ability to innovate and execute on solutions that matter; the ability to navigate ambiguity.* Strong written and verbal communication skills* Strong planning & organizational skills* Currently pursuing a PhD in Engineering or related field through an accredited degree program during the internship* Experience with advanced semiconductor packaging, semiconductor integration, hybrid bonding, TSV/TOV, interposers, design of experiments, or engineering data analysis* Availability for a six-month co-op assignment is preferred #InternshipProgramUS **Expected Salary Range** $20.00 - $40.00 **Expected Salary Range**$0.00 - $0.00The exact Salary will be determined based on qualifications, experience and location.If you need a reasonable accommodation for any part of the employment process, please contact us by email at [e-mail] and let us know the nature of your request and your contact information. Requests for accommodation will be considered on a case-by-case basis. Please note that only inquiries concerning a request for reasonable accommodation will be responded to from this email address.An offer with GlobalFoundries is conditioned upon the successful completion of pre-employment conditions, as applicable, and subject to applicable laws and regulations.