Technology Development Product Engineer

ADVANCED SUBSTRATE TECHNOLOGIES PTE. LTD.; Singapore; On-site; SGD 80,000 - 110,000; Full time

Job summary

ADVANCED SUBSTRATE TECHNOLOGIES PTE. LTD. seeks a Product Engineer/FAI Engineer to drive product bring-up, NPI, FAI, and manufacturing readiness.

You’ll lead cross-functional efforts across design, manufacturing, and quality to ensure smooth transitions from development to mass production and end-of-life. The ideal candidate has hands-on PCB/substrate fabrication experience, strong data analysis skills, and a track record of improving yield and process performance in semiconductor/electronics

Qualifications

• Bachelor’s degree in Electrical and Electronics Engineering or related field.
• 4–5 years of relevant experience in product engineering or electronics manufacturing.
• Strong background in semiconductor packaging, PCB/substrate manufacturing, and process development.
• Hands-on experience with manufacturing processes, product characterization, yield analysis, troubleshooting, and failure analysis.
• Experience leading or supporting NPI projects from verification through ramp and high-volume manufacturing is highly desirable.
• Strong understanding of mechanical engineering principles as applied to semiconductor packaging and product performance.
• Self-motivated, proactive, and able to work independently with minimal supervision.
• Strong interpersonal, communication, and cross-functional collaboration skills.

Responsibilities

• Lead end-to-end ownership of products through design, NPI, FAI, and mass production.
• Drive and monitor product performance, yield, reliability, quality, and field performance.
• Ensure products meet electrical, mechanical, quality, reliability, and manufacturing requirements.

Skills

Product engineering

Semiconductor manufacturing

PCB/substrate manufacturing

Yield analysis

Education

Bachelor’s degree or higher in Electrical and Electronics Engineering

Tools

AOI

AOS

DFR

Job description

Responsibilities

The Product Engineer (PE) / First Article Inspection Engineer (FAI) serves as a key technical interface between Design Engineering, Manufacturing, Process Engineering, Quality, and customer requirements. The role is responsible for driving product bring-up, New Product Introduction (NPI), FAI, manufacturing readiness, yield improvement, failure analysis, and continuous improvement throughout the product lifecycle—from initial product introduction through mass production and end-of-life.

The ideal candidate has strong experience in product engineering and semiconductor/electronics manufacturing, with hands‑on knowledge of PCB/substrate fabrication, electrical and mechanical performance, manufacturing processes, statistical data analysis, yield improvement, and failure analysis.

1. Product Ownership & Manufacturing Excellence

• Lead end-to-end ownership of assigned products throughout the product lifecycle, from design, NPI, and FAI through mass production and end-of-life.

• Drive and monitor product performance, manufacturing yield, reliability, quality, and field performance to meet operational and customer requirements.

• Ensure products meet defined electrical, mechanical, quality, reliability, and manufacturing requirements throughout the product lifecycle.

2. Yield Engineering & Continuous Improvement

• Analyze manufacturing and post‑manufacturing test data using statistical analysis and data‑mining techniques to identify trends/risk, root causes, and improvement opportunities.

• Drive corrective and preventive actions to improve yield, quality, cost, and manufacturing efficiency.

• Identify opportunities for continuous improvement.

• Establish appropriate sampling and data collection strategies from volume production units to monitor and optimize product and process performance.

3. Manufacturing Readiness & Production Support

• Support production ramp‑up and soft launch activities, monitoring product and process performance against defined targets.

• Support customer and internal technical reviews related to product performance, manufacturing readiness, quality, and reliability.

4. Product Engineering & Process Development

• Evaluate PCB and substrate manufacturing processes and their impact on product electrical, mechanical, and reliability performance.

• Apply knowledge of key PCB/substrate manufacturing processes, including:

• Build‑up insulation

• Dry Film Resist (DFR) patterning

• Plating

• Solder resist

• Automated Optical Inspection (AOI)

• Automated Optical Shaping (AOS)

Perform any other ad‑hoc duties as assigned by the Manager, as required to support the team and organizational goals.

Qualifications & Requirements

• Bachelor’s degree or higher in Electrical and Electronics Engineering, Electrical Engineering, Mechanical Engineering, or a related engineering discipline.

• Minimum 4–5 years of relevant experience in product engineering, semiconductor manufacturing, electronics manufacturing, or related industries.

• Strong background in product engineering, semiconductor packaging, PCB/substrate manufacturing, and process development.

• Hands‑on experience with manufacturing processes and product characterization, yield analysis, troubleshooting, and failure analysis.

• Experience leading or supporting NPI projects from product verification and qualification through production ramp and high‑volume manufacturing is highly desirable.

• Strong understanding of mechanical engineering principles and their application to semiconductor packaging and product performance.

• Self‑motivated, proactive, and able to work independently with minimal supervision.

• Strong interpersonal, communication, and cross‑functional collaboration skills.