Technical Program Manager

ACCTON TECHNOLOGY SG PTE. LTD.

Singapore

On-site

SGD 120,000 - 180,000

Full time

14 days+
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Job summary

ACCTON Technology SG PTE. LTD. in Singapore seeks a Technical Program Manager to lead multi-disciplinary engineering programs for optical transceiver and datacom product lines, driving NPI and factory bring-up from prototype to high-volume manufacturing.

You will coordinate design, process engineering, and production, translating complex optical/electrical/firmware specs into manufacturing milestones while mitigating risks through robust process improvements.

Qualifications

  • Bachelor's degree or above in Optical, Electrical, Mechanical, Manufacturing, or Industrial Engineering.
  • 7+ years in technical program management in optical transceiver, datacom, or optoelectronics manufacturing.
  • Proven track record managing NPI, product transfers, or factory bring-up in high-volume manufacturing.
  • Deep knowledge of optical transceiver assembly processes (Die Bonding, Wire Bonding, Active Alignment).
  • Experience with qualification standards, SPC, DOE, FMEA, CAPA, and ECO/ECN processes.

Responsibilities

  • Lead NPI and factory bring-up for optical transceivers and datacom products, from prototype to high-volume manufacturing.
  • Coordinate cross-functional teams across design, process engineering, and production; ensure milestones are met.
  • Mitigate risks, optimize yields, and manage supplier and component risk in a fast-paced environment.
  • Define and improve engineering development processes, communication, and metrics (velocity, quality, capacity).
  • Maintain program dashboards for timelines, risks, and resources to leadership.

Skills

Die Bonding
Wire Bonding
Active Alignment
Optical testing
NPI
ECOs/ECNs
SPC
Cross-functional leadership
Analytical decision-making

Education

Bachelor's degree or above in Optical Engineering, Electrical Engineering, Mechanical Engineering, Manufacturing Engineering, Industrial Engineering

Tools

Gantt charts
Microsoft Excel
PowerPoint

Job description

Position Summary

The Technical Program Manager (TPM) is responsible for leading, coordinating, and executing multi-disciplinary engineering programs for optical transceiver and datacom product lines withinthe manufacturing facility. This role focuses on driving New Product Introduction (NPI), factory bring-up activities, cross-functional execution,process optimization, and technical risk mitigation from prototype stagesthrough to high-volume manufacturing. A strong technical grounding in coreoptical assembly processes is essential to effectively guide cross-functionalteams and resolve factory bottlenecks.


Qualifications

Education

  • Bachelor's degree or above in Optical Engineering, Electrical Engineering, Mechanical Engineering, Manufacturing Engineering, Industrial Engineering, or a related technical discipline.

Experience

  • 7+ years of experience in technical program management, engineering management, or technical project leadership in optical transceiver, datacom, or optoelectronics manufacturing environments.

  • Proven track record of managing NPI, product transfers, or factory bring-up initiatives in high-volume manufacturing environments.

Technical Skills

  • In-depth understanding of core optical transceiver assembly processes, specifically Die Bonding, Wire Bonding, and Active Alignment, including their impact on device performance, yield, and throughput.
  • Strong understanding of optical transceiver manufacturing processes, hardware validation, optical/electrical testing, and packaging workflows.
  • Ability to translate complex optical, electrical, and firmware specifications into actionable manufacturing requirements and production milestones.
  • Deep knowledge of New Product Introduction (NPI) frameworks, phase-gate development methodologies, and engineering change management (ECOs/ECNs).
  • Familiarity with qualification standards, manufacturing quality frameworks, statistical process control (SPC), and root cause analysis methodologies (DOE, FMEA, PFMEA, CAPA).
  • Strong capability in dependency mapping, risk management, and resource allocation across hardware, software, and test engineering disciplines.

Soft Skills

  • Exceptional cross-functional leadership, communication, and stakeholder management abilities.
  • Strong analytical, data-driven decision-making, and problem-solving skills.
  • Proficient in project management tools, Gantt charts, Microsoft Excel, and PowerPoint.
  • Ability to drive execution and maintain alignment in a fast-paced, high-tech manufacturing environment.

Key Responsibilities

  • Factory Bring-Up & NPI Program Execution: Lead the technical program lifecycle for introducing new optical transceivers and datacom products into the manufacturing facility, coordinating milestones between product design, process engineering, and production teams from prototype to high-volume manufacturing (HVM).
  • Core Assembly & Process Integration: Leverage a deep working knowledge of critical transceiver packaging processes—including Die Bonding, Wire Bonding, and Active Alignment to partner directly
  • Yield Optimization & Supply Chain Risk Management: Proactively track and mitigate cross-functional risks impacting production timelines, such as component shortages (lasers, photodetectors, ICs) or equipment delays, collaborating with quality and engineering teams to address technical bottlenecks, improve first-pass yield (FPY), and drive root-cause analysis on manufacturing failures.
  • Process Optimization: Define, implement, and continuously improve engineering development processes, communication frameworks, and metrics tracking (e.g., velocity, quality, capacity, manufacturing yield), championing operational excellence through standardization across all participating design, test, and production teams.
  • Cross-Functional Governance & Alignment: Manage cross-team dependencies, facilitate technical trade-off decisions under constraint, and maintain program dashboards to communicate timeline progress, critical risks, and resource requirements to executive leadership.
  • Compliance & Validation: Oversee qualification cycles, ensuring alignment with industry standards (e.g., Telcordia, MSA specifications) while maintaining compliance with quality, safety, and operational governance standards across the factory floor.
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