Technical Program Manager

ACCTON TECHNOLOGY SG PTE. LTD.; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

ACCTON Technology SG PTE. LTD. in Singapore seeks a Technical Program Manager to lead multi-disciplinary engineering programs for optical transceiver and datacom product lines within the manufacturing facility.

The TPM will drive NPI, factory bring-up, cross-functional execution, process optimization, and risk mitigation from prototype to high-volume manufacturing. A strong technical grounding in optical assembly and experience managing complex schedules, budgets, and supplier coordination is

Qualifications

• 7+ years in technical program management, engineering management, or technical project leadership in optical transceiver, datacom, or optoelectronics manufacturing environments.
• Proven track record of managing NPI, product transfers, or factory bring-up initiatives in high-volume manufacturing environments.
• Bachelor's degree or higher in optical, electrical, mechanical, manufacturing, or industrial engineering or related technical discipline.

Responsibilities

• Lead the technical program lifecycle for introducing new optical transceivers and datacom products into the manufacturing facility, coordinating milestones between product design, process engineering, and production teams from prototype to high-volume manufacturing (HVM).
• Leverage deep knowledge of Die Bonding, Wire Bonding, and Active Alignment to partner with engineering teams and translate specs into manufacturing flows.
• Define, implement, and continuously improve engineering development processes, communication frameworks, and metrics tracking (velocity, quality, capacity, yield).
• Manage cross-team dependencies, facilitate technical trade-off decisions, and maintain program dashboards for leadership on timeline, risks, and resources.
• Oversee qualification cycles, ensuring alignment with Telcordia, MSA specs, and quality/safety/governance standards across the factory floor.

Skills

Cross-functional

NPI programs

Risk management

Project leadership

Data-driven decisions

Excel & PowerPoint

Education

Bachelor's degree

Tools

Gantt charts

MS Excel

PowerPoint

Job description

Position Summary

The Technical Program Manager (TPM) is responsible for leading, coordinating, and executing multi-disciplinary engineering programs for optical transceiver and datacom product lines withinthe manufacturing facility. This role focuses on driving New Product Introduction (NPI), factory bring-up activities, cross-functional execution,process optimization, and technical risk mitigation from prototype stagesthrough to high-volume manufacturing. A strong technical grounding in coreoptical assembly processes is essential to effectively guide cross-functionalteams and resolve factory bottlenecks.

Qualifications

Education

Bachelor's degree or above in Optical Engineering, Electrical Engineering, Mechanical Engineering, Manufacturing Engineering, Industrial Engineering, or a related technical discipline.

Experience

• 7+ years of experience in technical program management, engineering management, or technical project leadership in optical transceiver, datacom, or optoelectronics manufacturing environments.
• Proven track record of managing NPI, product transfers, or factory bring-up initiatives in high-volume manufacturing environments.

Technical Skills

• In-depth understanding of core optical transceiver assembly processes, specifically Die Bonding, Wire Bonding, and Active Alignment, including their impact on device performance, yield, and throughput.
• Strong understanding of optical transceiver manufacturing processes, hardware validation, optical/electrical testing, and packaging workflows.
• Ability to translate complex optical, electrical, and firmware specifications into actionable manufacturing requirements and production milestones.
• Deep knowledge of New Product Introduction (NPI) frameworks, phase-gate development methodologies, and engineering change management (ECOs/ECNs).
• Familiarity with qualification standards, manufacturing quality frameworks, statistical process control (SPC), and root cause analysis methodologies (DOE, FMEA, PFMEA, CAPA).
• Strong capability in dependency mapping, risk management, and resource allocation across hardware, software, and test engineering disciplines.

Soft Skills

• Exceptional cross-functional leadership, communication, and stakeholder management abilities.
• Strong analytical, data-driven decision-making, and problem-solving skills.
• Proficient in project management tools, Gantt charts, Microsoft Excel, and PowerPoint.
• Ability to drive execution and maintain alignment in a fast-paced, high-tech manufacturing environment.

Key Responsibilities

• Factory Bring-Up & NPI Program Execution: Lead the technical program lifecycle for introducing new optical transceivers and datacom products into the manufacturing facility, coordinating milestones between product design, process engineering, and production teams from prototype to high-volume manufacturing (HVM).
• Core Assembly & Process Integration: Leverage a deep working knowledge of critical transceiver packaging processes-including Die Bonding, Wire Bonding, and Active Alignment-to partner directly with engineering teams, translate technical specs into robust manufacturing flows, and ensure seamless NPI handoffs to the factory floor.
• Yield Optimization & Supply Chain Risk Management: Proactively track and mitigate cross-functional risks impacting production timelines, such as component shortages (lasers, photodetectors, ICs) or equipment delays, collaborating with quality and engineering teams to address technical bottlenecks, improve first-pass yield (FPY), and drive root-cause analysis on manufacturing failures.
• Process Optimization: Define, implement, and continuously improve engineering development processes, communication frameworks, and metrics tracking (e.g., velocity, quality, capacity, manufacturing yield), championing operational excellence through standardization across all participating design, test, and production teams.
• Cross-Functional Governance & Alignment: Manage cross-team dependencies, facilitate technical trade-off decisions under constraint, and maintain program dashboards to communicate timeline progress, critical risks, and resource requirements to executive leadership.
• Compliance & Validation: Oversee qualification cycles, ensuring alignment with industry standards (e.g., Telcordia, MSA specifications) while maintaining compliance with quality, safety, and operational governance standards across the factory floor.