SPG SmartStart Manufacturing Engineer

Applied Materials South East Asia; Singapore; On-site; SGD 110,000 - 170,000; Full time

Benefits offered by this job

Relocation assistance

Travel opportunities

Job summary

Applied Materials South East Asia is hiring a manufacturing/technical services engineer to develop and sustain start-up methods for semiconductor equipment, drive automation, and manage BoM integrity across multiple configuration sources. You will collaborate with cross-functional teams to resolve field issues and implement cost-reduction initiatives.

The role requires a bachelor’s degree in engineering and at least four years’ experience with semiconductor equipment, plus CAD/CAE proficiency

Qualifications

• Bachelor’s degree in engineering.
• Minimum 4 years of experience working with semiconductor equipment in manufacturing or technical field service.
• Hands-on experience with semiconductor process equipment; familiarity with MDP, EPI, ALD, CMP.
• Good understanding of mechanical, digitalization, and automation concepts, with the ability to read and interpret technical drawings and schematics.
• Good knowledge of system BoM structure, assembly processes, and procedure documentation.
• Proficiency with CAD software (e.g., SolidWorks), CAM tools (e.g., NX), SAP, and MS Office.

Responsibilities

• Develop, implement, and maintain methods, operating sequences, and processes for assemblies during start-up for semiconductor equipment.
• Lead the development and sustaining of field digitalized start-up procedures (iOMS) for Tier 0 & Tier 1 operations to improve efficiency and consistency.
• Allocate tasks to illustrators and oversee progress to ensure timely and high-quality OMS & DOC deliverables.
• Manage BoM integrity across SHPK, MERG, ship-along, SRD, and other configuration sources, ensuring accuracy and alignment with product requirements.
• Drive automation initiatives to enhance work proficiency and reduce production and delivery cycle times.
• Reduce I&W costs by identifying and correcting BoM errors, improving procedures, and lowering field NCs and start‑up cycle time through streamlined work processes.
• Review field NCs, analyze root causes, and work with corresponding teams develop action plans to prevent recurrence.
• Coordinate technical issues, RIT initiatives, and the introduction of new technologies and CIP projects across different business units and cross‑functional teams.
• Work independently with limited documentation when needed, investigating and compiling data to recommend improvements using established reporting processes.
• Collaborate with cross‑functional teams to drive complex projects related to quality issues, BoM optimization, and cost reduction.
• Interface with engineering teams to support the release of product improvements and new product instructions.
• Perform root cause analysis for issues arising during assembly and start‑up phases.
• Support engineering change requests and partner with design and operations teams to implement changes efficiently for both new and existing products.

Skills

Semiconductor equipment

Mechanical concepts

Digitalization concepts

Automation concepts

Communication skills

Education

Bachelor's degree in engineering

Tools

SolidWorks

NX CAM

SAP

MS Office

Job description

Who We Are

Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips – the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world – like AI and IoT. If you want to push the boundaries of materials science and engineering to create next generation technology, join us to deliver material innovation that changes the world.

Who We Are

Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips – the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world – like AI and IoT. If you want to push the boundaries of materials science and engineering to create next generation technology, join us to deliver material innovation that changes the world.

What We Offer

Location:Singapore,SGP

You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more.

At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits.

Responsibilities

Job Description

• Develop, implement, and maintain methods, operating sequences, and processes for the assemblies during start-up for semiconductor equipment.
• Lead the development and sustaining of field digitalized start-up procedures (iOMS) for Tier 0 & Tier 1 operations to improve efficiency and consistency.
• Allocate tasks to illustrators and oversee progress to ensure timely and high‑quality OMS & DOC deliverables.
• Manage BoM integrity across SHPK, MERG, ship-along, SRD, and other configuration sources, ensuring accuracy and alignment with product requirements.
• Drive automation initiatives to enhance work proficiency and reduce production and delivery cycle times.
• Reduce I&W (installation and warranty) costs by identifying and correcting BoM errors, improving procedures, and lowering field NCs and start‑up cycle time through streamlined work processes.
• Review field NCs, analyze root causes, and work with corresponding teams develop action plans to prevent recurrence.
• Coordinate technical issues, RIT initiatives, and the introduction of new technologies and CIP projects (e.g., 3D OMS) across different business units and cross‑functional teams.
• Work independently with limited documentation when needed, investigating and compiling data to recommend improvements using established reporting processes.
• Collaborate with cross‑functional teams to drive complex projects related to quality issues, BoM optimization, and cost reduction.
• Interface with engineering teams to support the release of product improvements and new product instructions.
• Perform root cause analysis for issues arising during assembly and start‑up phases.
• Support engineering change requests and partner with design and operations teams to implement changes efficiently for both new and existing products.

Requirements

Minimum Qualifications

• Bachelor’s degree in engineering.
• Minimum 4 years of experience working with semiconductor equipment in manufacturing or technical field service.

Technical Skills

• Hands‑on experience with semiconductor process equipment; familiarity with any of the following is an advantage: MDP, EPI, ALD, CMP.
• Good understanding of mechanical, digitalization, and automation concepts, with the ability to read and interpret technical drawings and schematics.
• Good knowledge of system BoM structure, assembly processes, and procedure documentation.
• Proficiency with CAD software (e.g., SolidWorks), CAM tools (e.g., NX), SAP, and MS Office.

Professional Competencies

• Strong analytical and problem‑solving skills; able to evaluate information and make sound decisions.
• Ability to work effectively within standardized processes to meet objectives and deadlines.
• Excellent communication skills and the ability to collaborate with multiple stakeholders and cross‑functional teams.
• Strong independent work ethic and accountability.

Other Requirements

• Able to work flexibly, including outside standard working hours, to collaborate with stakeholders across different time zones.
• Willingness to travel internationally to customer sites (approximately 10%).

Additional Information

Time Type:

Full time

Employee Type:

Assignee / Regular

Travel:

Yes, 10% of the Time

Relocation Eligible:

Yes

Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.