Principal/Senior Engineer, Advanced Package Metrology-Real-Time Defect Analysis (MRDA) Singapor[...]

Micron Memory Malaysia Sdn Bhd; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

Micron Technology, Inc. in Singapore seeks a Principal/Senior Engineer to lead Advanced Packaging Metrology-Real-Time Defect Analysis (MRDA).

You will develop metrology recipes, drive data analytics, and collaborate across teams to enable AI-enabled improvements in yield and performance. The role emphasizes innovation, process optimization, and cross-functional coordination with multiple engineering groups within Micron’s APDT.

Qualifications

• A degree in Mechanical, Chemical, Electrical Engineering or Physics or related field.
• 2+ years semiconductor process or equipment engineering experience.
• Proficiency in Python, R and SQL for analytics and modeling.
• Experience with Visual Basic for automation and tool integration.
• Familiarity with E3, FDC and RMS for equipment/process control.
• Strong data analytics for SPC, DOE, defect analysis and dashboarding.

Responsibilities

• Develop and optimize metrology recipes for semiconductor processes.
• Establish inspection methodologies and best-known methods for metrology.
• Perform in-line characterization and validation of metrology recipes.
• Leverage data analytics tools to summarize, report, and track project progress.
• Collaborate with cross-functional teams to integrate new metrology technologies.

Skills

Python

R

SQL

Statistics

Data analytics

DOE

Education

Engineering degree (B.S./M.S./Ph.D.)

Tools

Visual Basic for automation

E3

FDC

RMS

Power BI

Job description

Principal/Senior Engineer, Advanced Package Metrology-Real-Time Defect Analysis (MRDA) | Micron Technology # Single PositionChange the world through innovationView All Jobs## Principal/Senior Engineer, Advanced Package Metrology-Real-Time Defect Analysis (MRDA)Singapore, SingaporeApply NowFind out how well you match with this jobJob IDJR83214**Our vision is to transform how the world uses information to enrich life for all.**Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.**Micron’s vision is to transform how the world uses information to enrich life *for all*.**Join a world-class global team focused on one thing: using our expertise in the relentless pursuit of innovation to enable high value technology driven solutions for customers and partners. The solutions we create help make everything from virtual reality experiences to breakthroughs in supercomputing and artificial intelligence possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can spark the very innovation we are pursuing.We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing.We are looking for an Advanced Packaging Metrology-RDA Engineer to join our Advanced Packaging Technology Development (APTD) team!Your responsibilities include but are not limited to developing and enabling innovative inspection and metrology techniques to enable advanced packaging technologies. You will also be required to identify, diagnose, and propose yield related breakthroughs. You will have opportunity to work with peers and partners across organizations to coordinate the development and launch of new metrology and RDA technologies for solutions that drive the future. Additional responsibilities include establishing equipment evaluation and long-range strategy to enable advanced packaging technology roadmap. Key responsibilities and duties include:Recipe Development and Optimization:* Develop and optimize metrology recipes for various semiconductor processes* Ensure that the recipes are accurate and efficient for production needs* Develop and execute strategies for process monitoring, sampling, and continuous improvement (CIP)Inspection and Characterization:* Establish inspection methodologies and best-known methods (BKM) for metrology processes* Perform in-line characterization and validation of metrology recipesData Analysis and Reporting:* Utilize data analysis tools like Power BI to summarize and report on metrology recipe status and project progress* Continuously analyze data to identify improvement opportunities and ensure process efficiencyQuality and Performance Indicators:* Own and manage metrology tools, ensuring they meet performance indicators and quality standards* Drive the defense line readiness and set up control plans, OCAP (Out of Control Action Plans), and SPC (Statistical Process Control) chartsCollaboration and Coordination:* Engage in early involvement with Advanced Packaging Technology Development (APTD) to ensure seamless integration of new technologies* Work closely with various teams, including the Package Integration, PWF/Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality controlAI Responsibilities:* Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.* Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work.Requirements* B.S/M.S./Ph.D. (or equivalent education) in Mechanical Engineering, Chemical Engineering, Electrical Engineering, Physics, or other related technical fields* 2 or more years of semiconductor process or equipment engineering experience, preferably in wafer bonding, plating, warpage control and packaging field* Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics.* Experience with Visual Basic for automation and tool integration.* Familiarity with E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System) for equipment and process control.* Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding.* Strong understanding of process flows, process interactions, and how process changes can affect yield, performance, and reliability* Hands on experience with wafer/assembly tools or metrology/RDA systems* Tenacity to work effectively under timelines and limited resources* Consistent track record to solve problems and address root causes* Ability to apply baseline digital fluency and role‐appropriate AI literacy to use AI‐enabled tools responsibly and effectively for research, analysis, content creation, problem‐solving, operational tasks, and achieving business outcomes**About Micron Technology, Inc.**We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life *for all*. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron and Crucial brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience. To learn more, please visit micron.com/careers All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status. To request assistance with the application process and/or for reasonable accommodations, please contact hrsupport\[e-mail] Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.