Engineer, RD Packaging & Module Engineering

Ams Osram; Singapore; On-site; SGD 42,000 - 64,000; Full time

Job summary

ams OSRAM’s LSP unit seeks a passionate engineer to assist in integrating and optimizing end-to-end manufacturing processes. You will monitor performance, yield trends and quality indicators while supporting root cause analysis to drive corrective actions for process and product issues.

You will collaborate with process and product development teams to create process flows and initial equipment lists for projects, contributing to documentation like FMEA and buy-off records.

Qualifications

• Assist in integrating and optimizing end-to-end manufacturing process to meet product specifications and performance targets.
• Monitor process performance, yield trends and key quality indicators.
• Supporting root cause analysis and implement corrective actions for process and product-related issues.
• Collaborate with cross-functional teams to resolve product or process-related issues.

Responsibilities

• Developing and maintaining documentations like FMEA, machine and process buy-off document
• Working with process and product development engineers to create process flow and initial equipment list required in projects
• Collaborate with cross-functional teams to resolve product or process-related issues

Skills

Process optimization

Quality monitoring

Root cause analysis

FMEA documentation

Education

Electrical Engineering

Mechanical Engineering

Microelectronics

Optics

Job description

We are LSP – Light Sensors & Photonics, one of three business units within ams OSRAM, advancing the digitalization of light. At LSP, we go beyond traditional sensing—combining light, silicon, and system expertise to enable digital photonics solutions. Our focus is clear: powering next-generation applications in data centers, AR/VR, mobile and automotive, where light becomes a critical interface for data, perception, and interaction. This evolution marks a shift from components to integrated photonics systems —driving performance, scalability, and innovation in high-growth segments.

• Assist in integrating and optimizing end-to-end manufacturing process to meet product specifications and performance targets
• Monitor process performance, yield trends and key quality indicators
• Supporting root cause analysis and implement corrective actions for process and product-related issues
• Working with process and product development engineers to create process flow and initial equipment list required in projects
• Collaborate with cross-functional teams to resolve product or process-related issues
• Developing and maintaining documentations like FMEA, machine and process buy-off document

• Degree in Electrical, Electronics, Mechanical, Microelectronics, Materials, Optics or Chemical Engineering
• Preferred 3 - 5 years in either R&D, packaging technologies, manufacturing.
• Fresh graduates will be considered.
• Experience in sensor module packaging and/or optical engineering will be an advantage.