Sr. Principal Foundry Engineer – Logic/RF Device Expert

NXP SEMICONDUCTORS SINGAPORE PTE. LTD.; Singapore; On-site; SGD 120,000 - 160,000; Full time

Job summary

NXP SEMICONDUCTORS SINGAPORE PTE. LTD. in Singapore seeks a seasoned semiconductor device engineer to lead advanced node technology ramp-up and transfer focusing on logic and RF devices.

You will drive NTI initiatives, qualify FinFET processes, and coordinate with foundries and internal teams to achieve manufacturability, yield, and performance targets. The role requires deep device physics knowledge, hands-on HKMG/FinFET experience, and strong leadership to manage critical development and

Qualifications

• Bachelor’s or Master’s degree in Electrical Engineering, Physics, or related field.
• Minimum 10 years of experience in semiconductor device engineering.
• Hands-on experience with HKMG and FinFET technologies in production or development.
• Fluent in English and Mandarin.
• Demonstrated leadership in development, transfer, or ramp-up projects.

Responsibilities

• Collaborate with foundries, NXP tech teams, and business lines to qualify and release advanced FinFET processes.
• Provide technical leadership in semiconductor device physics, especially FinFET architecture and behavior.
• Interface with internal and external stakeholders on critical development and transfer projects.
• Lead and steer projects to meet timelines and business objectives.
• Make key decisions on process integration, balancing technical, logistical, and strategic factors.
• Support NTI process transfers within foundries and NXP joint ventures

Skills

Analytical skills

Leadership

Communication

Multilingual (English & Mandarin)

Proactive, results-driven

Education

Electrical Engineering or Physics degree

Tools

HKMG

FinFET

Job description

The APAC Central Competence Team partners with external foundries to ensure robust chip supply and technology enablement for NXP’s business lines. This role focuses on driving advanced node technology ramp-up and transfer, with a strong emphasis logic/RF devices. The primary responsibility of this role is to lead and support new technology introduction (NTI) and process transfers involving logic/RF technologies, ensuring manufacturability, yield, and performance targets are met.

The key areas of responsibility of the jobholder are:

• Collaborate closely with foundries, NXP technology teams, and business lines to qualify and release advanced FinFET processes.
• Provide technical leadership in semiconductor device physics, especially in FinFET architecture and behavior.
• Interface with internal and external stakeholders on critical development and transfer projects.
• Lead and steer projects to meet timelines and business objectives.
• Make key decisions on process integration, balancing technical, logistical, and strategic factors.
• Support NTI process transfers within foundries and NXP joint ventures

Requirements / preferences:

• Bachelor’s or Master’s degree in Electrical Engineering, Physics, or related field.
• Minimum 10 years of experience in semiconductor device engineering, with a strong focus on advanced logic/RF devices.
• Proven hands-on experience with HKMG and FinFET technologies in production or development environments.
• Deep understanding of semiconductor device physics, especially HKMG and FinFET.
• Strong analytical skills in yield enhancement and electrical data analysis.
• Fluent in English and Mandarin.
• Demonstrated leadership in development, transfer, or ramp-up projects.
• Excellent communication and influencing skills.
• Proactive, pragmatic, and results-driven mindset.
• Experience working with foundries and leveraging external manufacturing capabilities.