Senior Principal Foundry Engineer - HV/BCD Process Integration

nxp semiconductors singapore pte. ltd.; Singapore; On-site; SGD 90,000 - 140,000; Full time

Job summary

NXP Semiconductors Singapore Pte. Ltd. is seeking an Operations/Program Manager for 3rd party foundries to coordinate wafer manufacturing activities and ensure capacity coverage for STP/LTP.

You will drive delivery, throughput, yield and quality with a focus on corrective actions, while coordinating process changes and cross-functional projects. You will define timelines, monitor project execution, and lead process qualification and gate reviews, acting as the interface between NXP and External

Qualifications

• Bachelor or Master in Engineering/Material Science/Electronic.
• Minimum 7 years working experience in semiconductor fab (Process Integration, Device/Yield preferred).
• Fluent in English and Chinese.
• Able to work independently and also handle cross functional projects.

Responsibilities

• Co-ordinate all Wafer Manufacturing related activities.
• Ensure available capacity to cover STP and LTP volumes with type split and bottlenecks.
• Drive BBSC for 3rdParty Foundries for Delivery, throughput, Yield and Quality with follow-up actions.
• Monitor and manage process changes/improvements between 3rd Party Foundries and BLs.
• Coordinate and drive solutions to customer complaints on lots, yield and processing excursions.
• Define timelines, resources and risk mitigations for timely project completion.
• Monitor execution of projects per agreed timelines.
• Coordinate process qualification, product introduction and qualification.
• Chair process gate meetings and report to stakeholders.
• Interface between NXP and External Foundries during project execution.

Skills

Languages (English, Chinese)

Six Sigma Green Belt

SPC knowledge

Semiconductor devices knowledge

Process knowledge

KLA ACE XP

JMP

SPS

Education

Bachelor/Master in Engineering/Material Science/Electronic

Tools

KLA ACE XP

JMP

SPS

Job description

Operations 3rd Party Foundries :

• Co-ordinate all Wafer Manufacturing related activities.
• Ensure available capacity is in place to cover both STP and LTP volumes. Taking into account type split and capacity bottlenecks.
• Drive BBSC for all 3rdParty Foundries for Delivery, through put time, Yield and Quality including follow up on improvement actions
• Monitor, review and manage any process changes/improvements supporting requests both from 3rd Party Foundries to BL’s and from BL’s to 3rd Party Foundries.
• Co-ordinate and drive solutions to customer complaints hold lots and yield/processing excursions related to 3rdParty Foundry ensuring route cause is understood and corrective actions are in place.

Program management 3rdParty Foundries:

• Define time-line, resources, risk-mitigations (technical & non technical)activities to ensure timely and satisfactory completion of the project
• Be responsible for monitoring and controlling the execution of the project as per agreed time-line
• Drive all new product transfers activities in External Foundries with support of NXP project team (Innovation, mother fab, BL) and local project team of External Foundry
• Actively coordinate process qualification, product introduction and qualification
• Stimulate/oversee structural problems solving by use of statistical and quality tools
• Chair and organize process gate meetings
• Report to NXP stakeholders and External Foundries counterparts (PRB/Steering Committee)
• Be the interface between NXP and External Foundries during project execution
• Coordinate safe-launch and volume ramp-up implementation, monitor with support of the local technical team continuous yield & process improvement activities

General areas of responsibility include:

• Relation management and communication interface to all 3rdParty Foundries within their area.
• Drive Quarterly review with 3rdParty Foundries including follow up on actions
• Support Foundry Sourcing group in cost/price negotiations and discussions with both existing and new 3rd Party Foundries

Job Requirement :

Minimum Qualifications:

• Bachelor/Master in Engineering/Material Science/Electronic
• Minimum 7 years working experience preferably in semiconductor fab environment (Process Integration, Device/Yield engineer preferred)
• Well verse in English and Chinese
• Able to work independently and also handle cross functional projects

Preferred Qualifications:

• Six sigma green belt and above, SPC knowledge, Semiconductor Devices and Process knowledge
• Knows statistical tool KLA ACE XP, JMP, SPS etc