Principal Engineer, HIG-HBM Product Engineering (Media Health Reliability)

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.

Singapore

On-site

SGD 180,000 - 240,000

Full time

14 days+
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Job summary

Micron Semiconductor Asia Operations PTE. LTD. is seeking a senior leader to guide the HBM Product Engineering Media Health team in reliability test development and execution for the latest HBM products.

You will drive extrinsic DPM reduction and lead intrinsic reliability while optimizing the Manufacturing Test Flow to meet KPI quality, cost, and cycle time. You will mentor engineers and collaborate across fab, TD, GQ and reliability teams to enable yield improvements and cost reductions.

Qualifications

  • Bachelor’s or Master’s degree in Electrical and Electronics Engineering or related field.
  • 5+ years in semiconductor industry with product, testing, or reliability experience.
  • Familiarity with CMOS technology, DRAM architecture, and basic device physics.

Responsibilities

  • Reliability Test Flow Development: Define and develop reliability stress, test flows and test plans to cover all Product Reliability aspects.
  • Reliability Test Plan and Execution: Work with Global Quality to define qualification plan, manage execution progress, and resolve gating issues.
  • DPM reduction: Drive extrinsic and intrinsic reliability through optimized test flows and strategy to meet KPI’s Quality, Cost and Cycle Time.
  • Root Cause and Resolution of Qual and RMA Device Issues: Debug and identify root causes and failures using EFA and PFA; drive improvements with cross-functional teams.
  • Process Conversions and HVM: Provide recommendations to fab for new process conversions to reduce cost and increase yields.
  • Risk Management: Communicate with Product Managers to manage risks related to DPM process conversions.
  • Promotion of Innovation: Propose changes to gain technical advantage and maintain competitiveness.
  • Mentorship and Development: Actively develop and mentor engineers in reliability and AI adoption.
  • Project Management: Develop project management skills for efficient execution and timely delivery of solutions.
  • Technical Decision Making: Make final decisions on risk analysis and project prioritization.
  • Cross-Functional Collaboration: Collaborate with Fab, HBM Tech Development, HBM Design, System Development and Quality/Reliability teams.
  • AI Strategy for Reliability: Identify high-leverage AI use cases and pilot productionize solutions.

Skills

Problem solving
Teamwork
Communication
Attention to detail

Education

Bachelors/Masters in EE or related field

Tools

Python
JMP

Job description

Summary: As a key leader within High Bandwidth Memory (HBM) Product Engineering Media Health team, you will spearhead and develop a high performing team driving both intrinsic and extrinsic reliability test development and execution for Micron’s latest HBM products, both on DRAM and Interface die and a stacked product. Your responsibility is to drive extrinsic DPM reduction (Time 0 and Field DPM) and lead the intrinsic reliability charter, along with optimized Manufacturing Test Flow to meet critical KPI’s Quality, Cost and Cycle Time. You will be leading the team to characterize the products from reliability aspect, identify the reliability gaps, working on root cause and resolution of qual and RMA failures pertaining to defectivity and intrinsic reliability margin and drive fab process improvement driven by the qual failures. Additionally, your team will also be the key person in frontend process conversion, where you will work with Fab, TD, GQ teams to establish robust business process for process conversions to facilitate yield improvements, DPM and Cost Reduction. You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually maximizing the effectiveness of the HIG HBM PE organization. The future of HBM are exciting and dynamics. Micron is seeking experienced individuals that find technical challenges engaging and invigorating.

Responsibilities
  • Reliability Test Flow Development: Define and develop reliability stress, test flows and test plans to cover all Product Reliability aspects.

  • Reliability Test Plan and Execution: Work closely with Global Quality team to define qualification plan, review and manage the qualification execution progress, and drive for qualification gating issue resolution.

  • DPM reduction: Drive down and achieving Extrinsic Reliability (Time 0 and Field DPM) and Intrinsic Reliability through Optimized Manufacturing Test Flows and Test Strategy to meet critical KPI’s Quality, Cost and Cycle Time

  • Root Cause and Resolution of Qual and RMA Device Issues pertaining to defectivity and intrinsic reliability: Debug and identify root cause and failures in reliability tests by electric failure analysis(EFA) and Physical Failure Analysis (PFA) and drive for resolution and improvements through cross functional team collaboration.

  • Process Conversions and HVM: The role involves providing recommendation to fab teams for new process conversions to reduce cost, increase yields. This is critical as it directly impacts the yield, quality, reliability, and performance of HBM products, which are key components in many modern technologies.

  • Risk Management: The role requires communication with Product Managers/Leads to manage risks associated with DPM process conversions. This is crucial in ensuring that the conversions move at an appropriate pace, balancing the need for innovation with the need for stability and reliability.

  • Promotion of Innovation: The role involves promoting innovation and driving for changes that will provide Micron with a technical advantage over its competition. This is vital for maintaining Micron’s competitive edge in the market.

  • Mentorship and Development of Others: The role involves actively developing and mentoring others. This is important for the growth and development of the team and the organization.

  • Project Management: Developing project management skills within the team ensures efficient execution of projects, leading to timely delivery of technological solutions.

  • Technical Decision Making:The role involves making final decisions on risk analysis and project prioritization. These decisions directly impact the direction of technological development.

  • Cross-Functional Collaboration:This role necessitates collaboration with various cross-functional teams such as Fab, HBM Technology Development, HBM Design, System Development, and Quality/Reliability team. This collaboration is vital for the holistic development and shipping of end products.

  • AI Strategy for Reliability: Identify and scope high-leverage AI use cases by using Claude code, agentic AI etc in product qualifications; partner with internal teams to pilot and productionize solutions.

  • Applied Machine Learning: Proficient in applying machine learning (regression, classification, anomaly detection, clustering) and AI assisted tools to reliability datasets to segment fails, outliers etc.

  • AI-First Mindset & Mentorship: Actively coach engineers on AI adoption; embed AI/automation into reliability workflows as a standard practice, aligned with Micron's AI-first productivity direction.

Requirements
  • Bachelor’s or Master’s degree inElectrical and Electronics Engineeringor a related field.

  • 5+ years in semiconductor industry with product, testing, or reliability experience.

  • Coursework or internship experience insemiconductor devices,circuit design, orproduct validationis a plus.

  • Solid understanding ofproblem-solving methodologies, with a focus on identifying root causes and exploring solution spaces.

  • Familiarity withCMOS technology,DRAM architecture, and basicdevice physics.

  • Exposure todata analysis,statistics, and scripting tools such as Python or JMP.

  • Strong attention to detail and a commitment to quality.

  • Ability to work effectively inteam-based projects, contributing to shared goals and outcomes.

  • Flexible and eager to learn, with a willingness to take on diverse roles in a dynamic engineering environment.

  • Responsible and accountable, with a professional work ethic and ownership of assigned tasks.

  • Clear and effective written and spoken communication skills, especially when articulating technical concepts and findings

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