Senior/Staff Product Engineer (Pkg PE MFG), Heterogeneous Integration Group(HIG), High Bandwidth Memory (HBM)

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.; Singapore; On-site; SGD 110,000 - 170,000; Full time

Job summary

Micron Singapore is seeking a seasoned Product Engineer for HBM package and integration, driving yield, quality, and cost improvements across the HIG HBM PE portfolio.

You will lead cross-functional initiatives with Fab, Technology Development, and Packaging teams, mentor team members, and apply ML/AI techniques to optimize KPIs, with on-site work in Singapore and travel to Taiwan, US, and Japan. Experience in test flows and advanced packaging is preferred.

Qualifications

• Bachelor's or Master's degree in Electrical/Electronic/Mechanical Engineering.
• 5+ years in semiconductor industry.
• Experience in product engineering and packaging preferred.
• Strong root-cause analysis and problem solving skills.
• Familiar with statistics and data analysis tools; scripting.
• ML/AI experience a plus.
• Willing to work on-site in Singapore with travel to Taiwan/US/Japan.

Responsibilities

• ASM Yield and DPM Improvement: improve assembly-related coverage to reduce inline fallout.
• HBM Cube Yield Improvement through test optimization and coverage improvements.
• Lead cross-functional teams to enhance cumulative yield and quality.
• Root Cause and Resolution of Qual and RMA Packaging Issues with cross-functional collaboration.
• Process conversions with FAB, TD, and Packaging teams to improve yield and cost.
• Collaborate with Fab, TD, Design, System Development, and Quality teams to ship end products.
• Promote innovation and drive changes for competitive edge.
• Develop project management skills for timely delivery of solutions.
• Make technical decisions on risk analysis and project prioritization.
• Collaborate on AI/ML models to improve KPIs.

Skills

Electrical Engineering

Semiconductor Industry

Packaging Experience

Problem Solving

Statistics & Data Analysis

ML/AI

Leadership

Education

Bachelor's/Master's in Electrical/Electronic/Mechanical Engineering

Tools

Python scripting

Data analysis tools

Job description

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

As the member of HIG HBM Package Product Engineering, you will be part of a high-performing team to driving Package and HBM Product engineering activities within the HBM Systems and Product Engineering Team. You will be part of a Global team of professional Product Engineers leading a portfolio of Best-In-Class Next Generation HBM Product focused on the critical KPI’s Quality, Cost, Cycle Time and Scale. You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually maximizing the effectiveness of the HIG HBM PE organization.

Key Responsibilities

• ASM Yield and DPM Improvement: Accountable for improving assembly related coverage within the manufacturing flows to improve the Time 0 and Field DPM and reduce/prevent inline fallout within the assembly process.
• HBM Cube Yield Improvement: Improving HBM Cube yield through test optimization and coverages by collaboration with Technology Development and Packaging organizations to reduce Manufacturing Line Yield.
• Cumulative Yield Ownership: Work with cross-functional teams, to lead impactful initiatives that significantly enhance overall cumulative yield and quality improvement, driving substantial benefits for the organization.
• Root Cause and Resolution of Qual and RMA Packaging Issues: Debug and identify root cause and failures in by electric failure analysis(EFA) and Physical Failure Analysis (PFA) and drive for resolution and improvements through cross functional team collaboration.
• Backend Process Conversions and HVM: Work with FAB, Technology Development, Advanced Packaging TD, Package Development Teams to establish a robust Process Conversion Business Process to facilitate Yield Improvement, DPM Improvement and overall performance of HBM Products. Provide recommendation to PDE teams for new process conversions to reduce cost, increase yields. This is critical as it directly impacts the yield, quality, reliability, and performance of HBM products, which are key components in many modern technologies.
• Cross-Functional Collaboration: Work closely with various cross-functional teams, including Fab, HBM Technology Development, HBM Design, System Development, and Quality/Reliability teams, to ensure the holistic development and successful shipping of end products.
• Promotion of Innovation: Promote innovation and drive changes that provide a technical advantage over competitors, maintaining the company's competitive edge in the market.
• Project Management: Developing project management skills within the team ensures efficient execution of projects, leading to timely delivery of technological solutions.
• Technical Decision Making:The role involves making final decisions on risk analysis and project prioritization. These decisions directly impact the direction of technological development.
• AI/ML Advocate: Collaborate with cross-functional teams to develop, deploy, and validate AI/ML models aimed at enhancing key performance indicators (KPIs) such as Quality, Cost, Cycle Time, and Scale.

Requirements

• Bachelors/Masters of Electrical/Electronic/Mechanical Engineering Degree
• 5 or more years of experience in the semiconductor industry.
• Product Engineering and Packaging Experience is preferred.
• Demonstrating Competent Technical Skills, especially in problem solving with root cause understanding and solution space through in depth circuit analysis.
• Good knowledge of statistics and data analysis tools and scripting.
• Experience in Test flow handing.
• Experience in Assembly Process or Advanced packaging
• Experience in ML/AI works and usage of agents for work efficiency improvement will be added advantage.
• Dedicated and highly motivated with a flexible approach towards adapting to different roles in a dynamic working environment (from leading the team to leading technical programs).
• Proven track record of collaborative work within/across teams to address sophisticated business and engineering problems.
• Strong sense of responsibility and accountability towards assigned role with professional work ethic.
• Excellent communication and presentation skills.
• Passionate about people leadership, with a drive toward ongoing learning and development in this area.
• Work on site in Singapore with international travel opportunity to Taiwan, US, Japan.