Senior Signal Integrity Engineer – Networking Platforms

Hewlett Packard Enterprise Development LP

Singapore

On-site

SGD 180,000 - 280,000

Full time

14 days+
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Benefits offered by this job

Health & Wellbeing
Professional development
Inclusive culture

Job summary

Hewlett Packard Enterprise Development LP in Singapore seeks a Principal Signal Integrity Engineer for R&D Networking Platforms to define SI strategy, architect next-generation networks, and drive performance across multiple platforms.

You will lead high-speed interfaces, guide PCB stackups and validation, mentor engineers, and collaborate with ASIC, package, thermal, and system teams to deliver scalable, world-class networking solutions.

Qualifications

  • 15+ years of experience in signal integrity, power integrity, PCB design and high-speed system architecture.
  • Expert in high-speed digital design, electromagnetic theory, and channel optimization.
  • Strong experience with SI/PI simulation methods and lab measurement correlation.

Responsibilities

  • Define SI/PI strategy, design standards and engineering best practices across networking hardware.
  • Lead SI/PI architecture for next-generation networking systems from concept to production.
  • Provide leadership for high-speed interfaces and SerDes technologies.
  • Establish SI/PI guidelines, stackup strategies, routing, and validation approaches.
  • Mentor engineers across sites and drive cross-functional reviews to resolve complex challenges.
  • Collaborate with ASIC, package, PCB, mechanical, and thermal teams to optimize performance.

Skills

Signal integrity
Power integrity
High-speed design
SerDes
PCB design
EMI/EMC
Lab instrumentation
Technical leadership
Mentoring

Education

Bachelor's/Master's/PhD in Electrical Engineering

Tools

Synopsys HSPICE
Keysight ADS
Ansys HFSS
SIwave
PowerSI
Cadence

Job description

Hewlett Packard Enterprise Development LP in Singapore seeks a Principal Signal Integrity Engineer for R&D Networking Platforms to define SI strategy, architect next-generation networks, and drive performance across multiple platforms.

You will lead high-speed interfaces, guide PCB stackups and validation, mentor engineers, and collaborate with ASIC, package, thermal, and system teams to deliver scalable, world-class networking solutions.

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