As part of IME’s Silicon Photonics Department, the successful candidate will play a key role in developing next-generation optical modulators based on Photonics Heterogeneous Integration (PHI), leveraging thin-film lithium niobate (TFLN) integrated with silicon photonics platforms. We are seeking highly motivated researchers and engineers to drive innovations in heterogeneously integrated photonic integrated circuits (PICs) for next-generation data communication and interconnect applications.
You will collaborate with a multidisciplinary team spanning photonics design, semiconductor process integration, advanced packaging, and wafer fabrication operations. By utilizing state-of-the‑ahead industry‑standard wafer‑level manufacturing facilities, our team develops scalable photonic solutions with strong potential for high‑volume manufacturing.
Key Responsibilities
- Lead the development and implementation of novel device concepts and designs for the heterogeneous integration of lithium niobate (LN) on 200 mm and 300 mm silicon‑on‑insulator (SOI) platforms.
- Develop product‑ready TFLN‑on‑Silicon Photonics (SiPh) modulators targeting 400 Gbps‑per‑lane and beyond optical interconnect applications.
- Collaborate closely with photonics integration and process development teams to realize the co‑integration of TFLN modulators and germanium (Ge) photodetectors on a common silicon photonics platform.
- Analyze and correlate in‑line process data and off‑line characterization results to understand the impact of process variations on device performance and yield.
- Drive device optimization, process integration, and technology maturation toward manufacturable solutions.
- Manage and execute R&D projects efficiently, accelerating development cycles while delivering value to internal and external stakeholders.
- Engage with industry partners, foundry ecosystems, and research collaborators to advance heterogeneous photonic integration technologies.
Requirements
- PhD in Electrical Engineering, Physics, Materials Science, Photonics, Semiconductor Engineering, or a related discipline.
- Strong background in semiconductor device design, fabrication, or process integration.
- Experience in one or more of the following areas is highly desirable:
- Thin‑film lithium niobate (TFLN) modulators
- Silicon photonics devices and integration
- Heterogeneous integration and wafer bonding technologies
- Electro‑optic device design and characterization
- Hands‑on experience with Design of Experiments (DOE), statistical analysis, and data‑driven optimization methodologies.
- Familiarity with photonic simulation and design tools is an advantage.
- Excellent communication, technical presentation, and project management skills.
- Ability to work independently while collaborating effectively within multidisciplinary teams.
Additional Requirements For Senior Scientist Position
- Minimum 5 years of relevant industrial or research experience in semiconductor device design, photonic device development, or process integration.
- Demonstrated track record of technical leadership, project execution, and innovation in photonics or semiconductor technologies.