Senior Member of Technical Staff, NAND Advanced Thin Films Process Development

Micron Technology; Singapore; On-site; SGD 130,000 - 170,000; Full time

Job summary

Micron Technology in Singapore seeks a leader in 3D NAND Advanced thin film development to define technical strategy and lead multi-functional projects. With a PhD and 15-20 years of experience, you will architect solutions, enhance innovative processes, and mentor engineers to elevate technical standards. The role emphasizes advanced problem-solving across complex device interactions, supporting global collaborations to drive technical excellence. Strong proficiency in thin film processing and leadership in vendor collaboration are essential.

Qualifications

• 15 to 20 years of experience in Thin Film research and development for NAND processes.
• Demonstrated leadership in multi-functional development and vendor collaboration.
• Proven track record in architecting solutions and mentoring engineers.

Responsibilities

• Define technical strategy and lead multi-functional projects.
• Architect solutions and promote innovative technologies.
• Influence technical standards and drive process improvements.
• Mentor engineers and foster technical growth.
• Lead complex problem solving across process/device interactions.

Skills

Thin film processing (Plasma Enhanced CVD, Thermal CVD, ALD)

Structural and electric film hardware optimization

Reliability modeling

Advanced characterization techniques (SIMS, XPS, TEM)

Problem-solving and engineering support

Education

PhD or equivalent in Materials Science, Chemical Engineering, Physics, Chemistry, or Electrical Engineering

Job description

Position Overview

Acts as a technical authority in 3D NAND Advanced thin film development, setting strategic direction and leading multi-functional initiatives. Drives department-wide impact by architecting solutions, accelerating innovation adoption, and influencing technical standards. Engages in global projects and mentors engineers to elevate technical excellence.

Key Responsibilities

• Define technical strategy and lead multi-functional projects in structural and electric film development.
• Architect solutions and promote innovative technologies across teams.
• Influence technical standards and drive process improvements.
• Lead advanced process development, fixing, and integration.
• Mentor engineers and foster technical growth.
• Participate in global collaborations aligned with Micron's engineering expectations.
• Integrate unit processes into full module packages and validate within and cross-module interactions, device/process linkages via wafer-level electricals.
• Drive complex problem solving across process/structure/hardware/device interactions - root cause analysis, FMEA, SPC, and corrective actions that recover window with no yield trade-off.
• Utilize advanced characterization (SIMS, XPS, TEM, EDX/EELS, electrical stress testing, TDS) to correlate process parameters to device performance; derive correlation models that predict reliability and scaling behavior.
• Lead multi-functional teams and vendor engagements to push hardware/process capability, set achievements, and secure resources.
• Mentor engineers via structured training, case studies, and hands-on development; contribute to Micron's mentoring programs and help build SME pipelines for Advanced Thin Films.
• Publish internal papers, BKMs, and present to senior leadership; uphold Micron's TLP tenets: Innovate, Focus, Impact, Influence, Lead, Mentor.

Technical Expertise

• Advanced proficiency in thin film processing (Plasma Enhanced CVD, Thermal CVD, ALD).
• Hands-on experience with structural and electric film hardware and equipment optimization (dielectric and carbon based films).
• Hardware optimization: Precursor delivery & temperature control, chamber matching/segregation, batch vs single wafer trade-offs, metrology hooks.
• Strong understanding of process-mechanical-device interactions, reliability modeling, and 3D NAND scaling.
• Skilled in advanced characterization techniques (SIMS, XPS, TEM, electrical stress testing) and correlating process parameters to structural and device performance.
• Proven ability to lead technical problem-solving and support engineers developing their skills.

Requirements

• PhD or equivalent in Materials Science, Chemical Engineering, Physics, Chemistry, Electrical Engineering, or related field.
• 15 to 20 years of experience in Thin Film research and development for NAND process specifically plasma and thermal CVD for dielectric (including highK and lowK) and carbon-based depositions.
• Demonstrated leadership in multi-functional development and vendor collaboration.
• Proven track record in architecting solutions, process-device correlation, and mentoring engineers—aligned to Micron's SMTS leadership expectations.

Equal Employment Opportunity

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.