Senior Mechanical Engineer: Lead Thermal & Structural

HEWLETT PACKARD ENTERPRISE SINGAPORE PTE. LTD.

Singapore

On-site

SGD 70,000 - 90,000

Full time

8 days ago

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Job summary

Hewlett Packard Enterprise Singapore Pte. Ltd. seeks a Mechanical Engineer to design mechanical and thermal solutions for hardware systems and electronics enclosures, driving robustness through CFD and physical testing.

The role involves leading projects, collaborating with internal and external partners, and mentoring junior engineers while ensuring product performance and reliability.

Qualifications

  • Bachelor's or master's degree in mechanical engineering.
  • Typically, 4–6 years' experience.
  • Proficiency in Creo or other 3D CAD tools.
  • Strong analytical and problem‑solving skills.
  • Experience with electronics packaging, thermal and mechanical constraints.
  • Designing sheet metal and plastic parts, and familiarity with related tooling and manufacturing processes.
  • Ability to validate thermal performance using CFD tools.
  • Knowledge of structural simulation software (FEA) is advantageous.

Responsibilities

  • Design mechanical and thermal solutions for hardware systems, electronics enclosures, and related tooling.
  • Develop and execute test plans, including tolerance validation, form/fit/function checks, shock & vibration testing, EMI considerations, safety and reliability assessments, acoustic measurements, and thermal characterization.
  • Perform simulation-based evaluations using CFD, thermal mockups, and structural analysis tools to validate design performance and ensure mechanical robustness.
  • Collaborates and communicates with management, internal, and outsourced development partners regarding design status, project progress, and issue resolution.
  • Leads a project team of other mechanical hardware engineers and internal and outsourced development partners to develop reliable, cost effective and high-quality solutions for moderately- complex products.
  • Represents the mechanical/thermal team for all phases of larger and more-complex development projects.
  • Mentor and guide less-experienced engineers.

Skills

Creo CAD
CFD tools
FEA tools
Problem solving
English fluency

Education

Bachelor's or master's degree in mechanical engineering

Tools

ANSYS
CFD software

Job description

Hewlett Packard Enterprise Singapore Pte. Ltd. seeks a Mechanical Engineer to design mechanical and thermal solutions for hardware systems and electronics enclosures, driving robustness through CFD and physical testing.

The role involves leading projects, collaborating with internal and external partners, and mentoring junior engineers while ensuring product performance and reliability.

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