(Senior) Etch Process Engineer

Advanced Semiconductor Equipment Technology Singapore Pte. Ltd.; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

Advanced Semiconductor Equipment Technology Singapore Pte. Ltd. is seeking a (Senior) Process Engineer to develop plasma etch processes for MEMS/CIS/Power devices and advanced packaging. You will test and monitor equipment, update processes and assess tool condition.

The role requires 5+ years in wafer fab or etch equipment, ICP etch expertise, and strong problem-solving abilities. Travel regionally and internationally may be required; bilingual English/Mandarin is a plus.

Qualifications

• Min. degree in Engineering or related field.
• 5+ years in process engineering in wafer fab or etch equipment vendor.
• Must have ICP etch experience (field process support or development).
• Experience with TSV, deep silicon etch is advantageous.

Responsibilities

• Develop new plasma etch processes for polysilicon, nitride, or metal etching.
• Work with customers to maintain and optimize etch processes; coordinate process development.
• Qualify etch processes in installed base.
• Collaborate with engineering and product groups on improvement projects.
• Participate in customer meetings and resolve issues promptly.
• Troubleshoot process issues.
• Keep field operations informed of system performance evaluation.
• Provide guidance to less experienced engineers or customers.
• Assist with ad-hoc duties/projects as assigned by Manager.

Skills

Polysilicon etch

Nitride etch

Metal etch

Process development

Cross-functional collaboration

Education

Bachelor's degree in Engineering or related field

Tools

ICP etcher

Through Silicon Via (TSV)

Capacitively Coupled Plasma (CCP) etcher

Job description

Job Purpose

The Etch (Senior) Process Engineer develops plasma etch processes for MEMS/CIS/Power Devices/Advanced Packaging and/or memory/logicetch applications in support of our sales activities to customers, during installation and after service care. Their main duties include process testing and monitoring of the equipment, updating current system processes and conducting assessments of the working condition of our tools.

Principal Accountabilities

1. Develop new plasma etch processes for above mentioned semiconductor industry segments with strong focus onpolysilicon and nitride or metal etch.
2. Work with customer to maintain & optimize current plasma etch processes, including coordinating and conducting etchprocess development
3. Qualify etch processes in installed base
4. Work with engineering and product group for continuous improvement project
5. Participate in customer meetings, escalations and resolve customer problems in a timely manner
6. Troubleshoot process issues
7. Keep field operations and management team informed of customer’s evaluation and perception of system performance
8. Provide technical guidance to less experienced process engineers and/or customer
9. Any other ad-hoc duties / projects as assigned by Manager

Education & Experience

• Min. Degree in Engineering or related engineering fields
• More than 5 years of relevant experience in process engineering (sustenance or development) in a wafer fab or etch equipment vendor position, preferably with at least 2-3 years experience on Etch process/equipment
• Prior field process support or development experience inInductively Coupled Plasma(ICP)etcher is amust
• Technical knowledge of deep Silicon etch using Bosch process onThrough Silicon Via (TSV), plasma dicing or deep trench applications is advantageous
• Some experience in Capacitively Coupled Plasma (CCP) etcher will be bonus

Essential Attributes

• Independent and willing to accept challenges
• Willing to travel both regionally and internationally to support overseas installed base
• Flexibility to work on shift/ overtime/ stand-by/ on-call/ holidays when required
• Bilingual in English and Mandarin as counterparts are mostly Chinese speaking