Senior Equipment Engineer - Advanced Packaging & Uptime

Lumilens Inc.; Singapore; On-site; SGD 120,000 - 180,000; Full time

Benefits offered by this job

Competitive salary

Career advancement

World-class team

Collaborative environment

Job summary

Lumilens is building essential photonics infrastructure for AI supercomputing. The role leads lifecycle management of advanced semiconductor tools, from procurement to optimization, ensuring high uptime and yield.

The candidate will own equipment performance, drive FAT/SAT sign-offs, and implement predictive maintenance strategies to minimize downtime. Required are strong hands-on skills with packaging and wafer-level assembly equipment, plus experience in vendor selection and defining equipment

Qualifications

• Hands-on experience operating, troubleshooting, and maintaining advanced packaging and wafer-level assembly equipment.
• Experience designing predictive maintenance programs to optimize uptime and yield.
• Proven track record of equipment specifications, vendor selection, and FAT/SAT sign-offs.

Responsibilities

• Equipment Lifecycle Management: lead evaluation, procurement, setup and qualification of new manufacturing equipment and facilities.
• Advanced Tool Ownership: own back-grinders, dicers, expanders, bonders, pick-and-place, reflow ovens and solder printers.
• Uptime Optimization: own uptime, minimize unscheduled downtime on the production floor.
• Maintenance Strategy: design and execute preventive and predictive maintenance programs for all production equipment.

Skills

Equipment troubleshooting

Predictive maintenance

Vendor management

Root-cause analysis

Mechatronics

Education

Bachelors in ME

Job description

Lumilens is building essential photonics infrastructure for AI supercomputing. The role leads lifecycle management of advanced semiconductor tools, from procurement to optimization, ensuring high uptime and yield.

The candidate will own equipment performance, drive FAT/SAT sign-offs, and implement predictive maintenance strategies to minimize downtime. Required are strong hands-on skills with packaging and wafer-level assembly equipment, plus experience in vendor selection and defining equipment