Senior Engineer - Electrical Failure Analysis, NTI

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.

Singapore

On-site

SGD 120,000 - 180,000

Full time

3 days ago
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Job summary

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD. seeks an experienced Electrical Failure Analysis Senior Engineer to diagnose yield-limiting failures in NAND devices.

You will combine bench testing, probe data analysis and physical FA to pinpoint failure mechanisms and accelerate learning. You will lead RCA, develop new FA methods, apply data analytics to large datasets, and deliver clear FA reports and visuals for diverse audiences.

Qualifications

  • MS/PhD in Electrical Engineering or related field required.
  • Proven semiconductor Failure Analysis experience.
  • Strong knowledge of NAND/NOR memory technologies.

Responsibilities

  • Lead electrical failure analysis: characterization, fault isolation, failure verification, and de-processing of devices.
  • Drive root cause analysis of yield-limiting failures using electrical, inline, parametric, probe, and fab data.
  • Develop new FA methodologies and de-processing techniques to improve detection and turnaround.
  • Apply data analytics to large semiconductor datasets to identify failure signatures and trends.
  • Prepare FA reports and visualizations for technical and executive audiences.
  • Collaborate with Process Integration, Yield, Metrology, RDA, and Data Science teams to drive yield improvements.
  • Support technology transfer of layout and architecture fundamentals from R&D to manufacturing.
  • Present results in global forums with cross-functional teams.

Skills

Electrical failure analysis
Bench testing
Probe data analysis
Physical failure analysis
Data analytics
FA reporting
Communication skills
Presentations

Education

M.S./Ph.D. in Electrical Engineering or related field

Tools

SEM
FIB
TEM
EDS
EELS

Job description

Join our NAND Technology Integration (NTI) team as an experienced Electrical Failure Analysis Senior Engineer, where you will be the go-to expert for diagnosing yield-limiting failures in next-generation NAND products. You will combine deep semiconductor expertise with bench testing, probe data analysis, and physical failure analysis to pinpoint failure mechanisms, accelerate yield learning, and deliver actionable insights that shape the technology development lifecycle.

Key Responsibilities
  • Lead electrical failure analysis — characterization, fault isolation, failure verification, and physical de-processing of semiconductor devices.

  • Drive root cause analysis of yield-limiting failures by correlating electrical, inline, parametric, probe, and fab data.

  • Pioneer new FA methodologies and de-processing techniques to improve detection accuracy and turnaround time.

  • Apply data analytics to large-scale semiconductor datasets to surface failure signatures, trends, and anomalies.

  • Deliver clear FA reports and visualizations that communicate findings to technical and executive audiences.

  • Partner with Process Integration, Yield Enhancement, Metrology, RDA, and Data Science teams to drive yield improvement.

  • Support technology transfer of layout and architecture fundamentals from R&D to manufacturing.

  • Present results in global forums with Product Development, Process Integration, and Manufacturing teams.

  • Communicate with strong explainability — backed by feature importance, sensitivity analysis, and failure trend narratives.

  • Adhere to all health, safety, and environmental standards.

Artificial Intelligence
  • Using, applying and leveraging AI, identify opportunities to streamline workflows, optimize processes, and support innovation by incorporating AI-driven solutions and enabling data-driven decision making across projects and teams.

Qualifications and Experience
  • M.S., or Ph.D. in Electrical Engineering, Microelectronics, Materials Science, Chemical Engineering, Physics, or a related field.

  • Proven semiconductor industry experience in Failure Analysis, Process Integration, Yield Enhancement, or Unit Process.

  • In-depth knowledge of nonvolatile memory technologies (NAND/NOR).

  • Strong grasp of semiconductor process flow and process–device interactions.

  • Hands-on or theoretical expertise with SEM, FIB, TEM, and elemental analysis (EDS, EELS).

  • Excellent analytical, communication, and presentation skills — able to translate complex findings into clear narratives.

  • Self-motivated, with a track record of thriving in a fast-paced, dynamic environment.

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