Senior Engineer (Bond Equipment)

Vanguard International Semiconductor Corporation (VIS); Singapore; On-site; SGD 90,000 - 140,000; Full time

Job summary

Vanguard International Semiconductor Corporation (VIS) is seeking a senior Equipment Owner and SME for wafer bonding within the Lithography (Photo) Department to ensure top-tier equipment performance, reliability, and manufacturing capability.

You will lead selecting and deploying new equipment, drive lifecycle management, and push continuous improvement to maximize yield, uptime, throughput, and cost efficiency across the line.

Qualifications

• Bachelor's degree in a relevant engineering discipline.
• Minimum 3 years of semiconductor equipment or process engineering experience.
• Hands-on experience with wafer bonders and related equipment.
• Strong knowledge of troubleshooting, process optimization, and production support.
• Experience developing preventive and predictive maintenance strategies.
• Ability to execute upgrades and continuous improvement projects.
• Excellent communication and stakeholder management skills.

Responsibilities

• Serve as Equipment Owner and SME for wafer bonding equipment in Lithography (Photo) Department.
• Lead evaluation, selection, qualification, and deployment of new equipment and capital investments.
• Drive equipment strategy, lifecycle management, and continuous improvement for yield, uptime, throughput, and cost.
• Lead installation, qualification, transfer, upgrades, and sustaining activities for wafer bonders and related tools.
• Establish long-term reliability plans by analyzing performance and addressing chronic issues.
• Collaborate with process, quality, facilities, and global teams to resolve technical challenges.
• Manage equipment vendors to meet uptime and service targets; optimize spares and responses.
• Lead cross-functional projects for yield, cycle-time reduction, capacity expansion, and automation.
• Use SPC, FDC, and data analytics to identify optimization opportunities.
• Champion alarm reduction, predictive maintenance, and Industry 4.0 initiatives.

Skills

Equipment ownership

SME

Cross-functional leadership

Data analytics

Predictive maintenance

Industry 4.0

Root cause analysis

Mentoring

Education

Bachelor's degree in Electrical/ Electronics/ Mechanical/ Mechatronics/ Microelectronics Engineering

Tools

Wafer bonders

Gemini bonders

SAM Coat

Process equipment

Job description

Job Description

• Serve as the primary Equipment Owner and Subject Matter Expert (SME) for wafer bonding equipment within the Lithography (Photo) Department, ensuring best-in-class equipment performance, reliability, and manufacturing capability.
• Lead the evaluation, selection, qualification, and deployment of new equipment, technologies, and capital investments to support business growth and technology roadmap requirements.
• Drive equipment strategy, lifecycle management, and continuous improvement initiatives to achieve operational excellence in yield, uptime, throughput, and cost efficiency.
• Lead equipment installation, qualification, conversion, transfer, upgrades, and sustaining activities for wafer bonders, Gemini bonders, SAM Coat, and associated process equipment.
• Establish long-term reliability improvement plans by analyzing equipment performance, identifying chronic issues, and implementing sustainable corrective and preventive actions.
• Partner with process, manufacturing, quality, facilities, and global engineering teams to resolve complex technical challenges affecting production and customer commitments.
• Manage and drive equipment vendors to achieve performance targets related to uptime, MTTR, MTBF, OEE, spare parts management, and service responsiveness.
• Lead cross-functional projects focused on yield enhancement, cycle-time reduction, defect reduction, capacity expansion, cost optimization, and automation implementation.
• Utilize SPC, FDC, equipment intelligence, and advanced data analytics to identify opportunities for process and equipment optimization.
• Champion alarm reduction, equipment robustness, predictive maintenance, and Industry 4.0 initiatives through machine control and data-driven methodologies.
• Develop and standardize best practices, maintenance strategies, troubleshooting methodologies, OCAPs, and engineering procedures across the department.
• Act as technical lead during critical tool excursions, ensuring effective root cause analysis and timely recovery plans.
• Mentor and coach engineers, technicians, and production personnel to strengthen technical competencies and troubleshooting capabilities.
• Provide technical leadership during NPI, process transfer, customer qualification, and manufacturing scale-up activities.
• Drive a culture of continuous improvement, operational discipline, and engineering excellence across the Photo Department.

Job Description

• Serve as the primary Equipment Owner and Subject Matter Expert (SME) for wafer bonding equipment within the Lithography (Photo) Department, ensuring best-in-class equipment performance, reliability, and manufacturing capability.
• Lead the evaluation, selection, qualification, and deployment of new equipment, technologies, and capital investments to support business growth and technology roadmap requirements.
• Drive equipment strategy, lifecycle management, and continuous improvement initiatives to achieve operational excellence in yield, uptime, throughput, and cost efficiency.
• Lead equipment installation, qualification, conversion, transfer, upgrades, and sustaining activities for wafer bonders, Gemini bonders, SAM Coat, and associated process equipment.
• Establish long-term reliability improvement plans by analyzing equipment performance, identifying chronic issues, and implementing sustainable corrective and preventive actions.
• Partner with process, manufacturing, quality, facilities, and global engineering teams to resolve complex technical challenges affecting production and customer commitments.
• Manage and drive equipment vendors to achieve performance targets related to uptime, MTTR, MTBF, OEE, spare parts management, and service responsiveness.
• Lead cross-functional projects focused on yield enhancement, cycle-time reduction, defect reduction, capacity expansion, cost optimization, and automation implementation.
• Utilize SPC, FDC, equipment intelligence, and advanced data analytics to identify opportunities for process and equipment optimization.
• Champion alarm reduction, equipment robustness, predictive maintenance, and Industry 4.0 initiatives through machine control and data-driven methodologies.
• Develop and standardize best practices, maintenance strategies, troubleshooting methodologies, OCAPs, and engineering procedures across the department.
• Act as technical lead during critical tool excursions, ensuring effective root cause analysis and timely recovery plans.
• Mentor and coach engineers, technicians, and production personnel to strengthen technical competencies and troubleshooting capabilities.
• Provide technical leadership during NPI, process transfer, customer qualification, and manufacturing scale-up activities.
• Drive a culture of continuous improvement, operational discipline, and engineering excellence across the Photo Department.

Job Requirements

• Bachelor's Degree in Electrical, Electronics, Mechanical, Mechatronics, Microelectronics Engineering, or related Engineering discipline.
• Minimum 3 years of semiconductor equipment or process engineering experience, preferably in Lithography/Photo, Advanced Packaging, or Wafer Bonding operations.
• Hands-on experience with Wafer Bonders, Gemini Bonders, SAM Coat equipment.
• Strong knowledge of equipment troubleshooting, process optimization, equipment qualification, and production support in a high-volume manufacturing environment.
• Experience in developing, implementing, and sustaining preventive and predictive maintenance strategies to maximize equipment uptime and performance.
• Ability to execute equipment upgrades, hardware modifications, and continuous improvement projects to enhance reliability, capability, and operational efficiency.
• Strong analytical and logical thinking skills with a proven track record of driving effective problem resolution.
• Excellent communication, interpersonal, and stakeholder management skills.
• Willing to work Normal Shift, Swing Shift, or 12-hour rotating shift when required.