Senior 3D NAND Process Architect & Reliability Lead

Brightecs Innovation Pte Ltd

Singapore

On-site

SGD 140,000 - 210,000

Full time

14 days+
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Job summary

Brightecs Innovation Pte. Ltd. (BIP) seeks a senior specialist to lead 3D NAND device architecture design, process integration, and reliability analysis. You will design DoE studies, assess variation impacts, and push technology iterations with the process development team.

You will also write technical reports and assist customers or internal teams in resolving related issues, drawing on deep domain knowledge in 3D NAND physics and advanced manufacturing processes.

Qualifications

  • Master's degree or above
  • Major: Microelectronics, physics, material science & engineering, chemistry
  • 8+ years of semiconductor device work experience, 3+ years of 3D NAND work experience
  • In-depth knowledge of 3D NAND device physics, familiar with its principles, failure modes, and reliability mechanisms
  • Troubleshooting, and problem-solving capabilities, with experience in successfully improving device performance or yield
  • Familiar with advanced semiconductor manufacturing processes and integration flows
  • Strong cross-team communication and collaboration skills

Responsibilities

  • Lead the architecture design (e.g. memory cells, select transistors, and peripheral devices), process integration, electrical characterization, modeling and simulation, failure analysis for 3D NAND devices.
  • Design and execute DoE, analyze the impact of process variations on device performance and reliability (such as durability and data retention), and propose improvement solutions.
  • Collaborate with the process development team to assess new device architectures, driving technology iteration.
  • Write detailed technical reports and support customers or internal teams in resolving related technical issues.

Skills

Device physics
3D NAND
Troubleshooting
Problem solving
Cross-team collaboration
Reliability analysis

Education

Master's degree or above
Major: Microelectronics, physics, material science & engineering, chemistry

Job description

Brightecs Innovation Pte. Ltd. (BIP) seeks a senior specialist to lead 3D NAND device architecture design, process integration, and reliability analysis. You will design DoE studies, assess variation impacts, and push technology iterations with the process development team.

You will also write technical reports and assist customers or internal teams in resolving related issues, drawing on deep domain knowledge in 3D NAND physics and advanced manufacturing processes.

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