Semiconductor Pilot-Line Lead: Wafer Bonding & Epitaxy

National University of Singapore; Singapore; On-site; SGD 110,000 - 160,000; Full time

Job summary

The National University of Singapore seeks a seasoned engineer to transform a lab-scale semiconductor process into a repeatable, industry-grade pilot line that ships credible samples with traceability.

You will own end-to-end process flows, lock recipes for scale, drive yield engineering and process control, and coordinate with external foundries and suppliers while delivering comprehensive transfer documentation for industry sampling.

Qualifications

• Proven experience in semiconductor process development, integration, or pilot-line scale-up.
• Hands-on expertise in wafer bonding, epitaxial growth (111-V and/or GaN), and supporting unit processes such as CMP, thermal processing, and metallization readiness.
• Experience defining end-to-end process flows and transitioning technologies from lab or prototype stage to pilot production.
• Strong background in yield engineering, SPC, process control, and root-cause analysis.
• Experience selecting, qualifying, and sustaining semiconductor process equipment and metrology tools.
• Experience producing comprehensive process documentation and transfer packages suitable for industry-grade sampling.
• Prior experience leading or mentoring multi-disciplinary engineering teams.

Responsibilities

• Define the pilot-line process architecture & roadmap for the targeted platform.
• Develop, optimise, and lock process recipes for scale across modules.
• Lead hands-on development across critical modules including wafer bonding, MOCVD epitaxy, CMP, and metallization readiness.
• Implement pilot-ready quality backbone with CTQ, SPC monitors and root-cause analysis.
• Coordinate with external foundries and suppliers for integration and supply-chain stability.
• Produce transfer packages with process flows, BOMs, specs, and traceability.
• Lead a multi-disciplinary team spanning process, integration, metrology and equipment.

Skills

Semiconductor process development

Wafer bonding

Epitaxial growth (111-V/GaN)

Process documentation

Transfer packages

Team leadership

SPC / process control

Tools

MOCVD epitaxy equipment

Wafer bonding equipment

CMP tools

Job description

The National University of Singapore seeks a seasoned engineer to transform a lab-scale semiconductor process into a repeatable, industry-grade pilot line that ships credible samples with traceability.

You will own end-to-end process flows, lock recipes for scale, drive yield engineering and process control, and coordinate with external foundries and suppliers while delivering comprehensive transfer documentation for industry sampling.