Semiconductor Equipment Engineer – Production & Reliability

Atomic Recruitment SEA; Singapore; On-site; SGD 42,000 - 62,000; Full time

Job summary

Atomic Recruitment SEA is assisting a leading global semiconductor company in Singapore to hire an Associate Equipment Engineer. This role focuses on supporting reliability and line performance by maintaining and setting up critical semiconductor equipment on site.

The ideal candidate holds an engineering diploma/degree and demonstrates hands-on experience with back grind, wafer saw, wafer mount or de-taping equipment, with strong troubleshooting and independent problem-solving abilities in a

Qualifications

• Diploma or Degree in Electrical, Electronics, Mechanical, Mechatronics, Chemical, Materials Science or related engineering.
• Hands-on experience with Back Grind, Wafer Saw, Wafer Mount or Taping / De-taping equipment.
• Semiconductor manufacturing experience is highly preferred.
• Able to work independently and solve technical issues in a production environment.

Responsibilities

• Troubleshoot, repair and maintain semiconductor manufacturing equipment.
• Perform preventive maintenance and equipment setup.
• Support machine conversion, device setup and production line sustaining.
• Support device and recipe creation, equipment buy-off, evaluation and qualification.
• Provide engineering support for New Product Introduction (NPI).
• Collaborate with Manufacturing, Process, QA and NPI Engineering teams to resolve issues.
• Drive equipment improvements to enhance productivity, quality and reliability.

Skills

Equipment troubleshooting

Maintenance skills

Independent worker

Education

Engineering Diploma/ Degree

Tools

Back Grind

Wafer Saw

Wafer Mount

Taping/De-taping

Job description

Atomic Recruitment SEA is assisting a leading global semiconductor company in Singapore to hire an Associate Equipment Engineer. This role focuses on supporting reliability and line performance by maintaining and setting up critical semiconductor equipment on site.

The ideal candidate holds an engineering diploma/degree and demonstrates hands-on experience with back grind, wafer saw, wafer mount or de-taping equipment, with strong troubleshooting and independent problem-solving abilities in a