Research Associate (High Temperature-Resistant & Miniaturized Payload Hardware Design)

Nanyang Technological University Singapore; Singapore; On-site; SGD 50,000 - 70,000; Full time

Job summary

Nanyang Technological University Singapore is seeking a hardware-focused Research Associate for the Centre for Advanced Robotics Technology Innovation (CARTIN). The role involves designing and prototyping a compact and heat-resistant multi-sensor payload that can withstand extreme temperatures of up to 250°C while ensuring the internal electronics remain below 55°C. Ideal candidates will have a Bachelor or Master in Mechanical Engineering or Mechatronics, strong experience in heat-resistant design, and proficiency with thermal simulation tools like ANSYS and SolidWorks.

Qualifications

• Strong experience in heat-resistant enclosure design and miniaturized hardware integration.
• Familiar with thermal simulation tools such as ANSYS and SolidWorks.
• Experience with IP65/IP67 standards and fanless computing.

Responsibilities

• Design compact mechanical housing to operate under 250°C.
• Ensure internal core temperature remains under 55°C during runtime.
• Select and integrate miniaturized components including compute, battery, and sensors.

Skills

Heat-resistant enclosure design

Miniaturized hardware integration

Thermal simulation tools

Embedded design

Understanding of IP65/IP67 standards

Education

Bachelor or Master in Mechanical Engineering

Mechatronics or similar

Tools

ANSYS

SolidWorks

Job description

Key Responsibilities

• Design compact mechanical housing to operate under 250°C ambient conditions.
• Ensure internal core temperature remains under 55°C during runtime.
• Select and integrate miniaturized components (compute, battery, sensors).
• Strip sensor casings and reassemble into a custom mount with thermal shielding.
• Perform heat simulation, thermal insulation, and shock‑resistance design.
• Test hardware in specified sites and environments.

Job Requirements

• Bachelor or Master in Mechanical Engineering, Mechatronics, or similar.
• Strong experience in heat‑resistant enclosure design and miniaturized hardware integration.
• Familiar with thermal simulation tools (ANSYS, SolidWorks, etc.).
• Experience with IP65/IP67 standards, fanless computing, and embedded design.
• Knowledge of fire‑fighting robot or harsh‑environment robotic platforms is a plus.

Centre for Advanced Robotics Technology Innovation (CARTIN) is looking for a hardware‑focused Research Associate to design and prototype a compact and heat‑resistant multi‑sensor payload. The system must withstand temperatures of 250°C for 10 minutes (without external cooling) while maintaining internal stability for embedded electronics.

Join our team to build a compact and thermally protected SLAM sensor payload for extreme environments. The candidate will design hardware that survives 250°C conditions while maintaining internal electronics under 55°C. Experience with high‑temperature materials, mechanical CAD, and embedded platform integration is essential. Ideal for Mechatronics/Mechanical engineers with strong prototyping skills.

Hiring Institution: NTU