R&D Mechanical Engineer | Semiconductor Equipment | Admirax

The Supreme HR Advisory Pte Ltd; Singapore; On-site; SGD 45,000 - 67,000; Full time

Benefits offered by this job

Health insurance

Job summary

The Supreme HR Advisory Pte. Ltd. is seeking a Mechanical Design Engineer to design mechanical systems for advanced semiconductor packaging equipment.

You will create 3D models, detailed drawings, BOMs, and technical documentation, and collaborate with process, electrical, software, and manufacturing teams. The role requires a diploma or bachelor's in Mechanical Engineering or related field and about 2+ years of design experience with precision machinery.

Qualifications

• Diploma or bachelor’s in Mechanical Engineering or related field.
• 2+ years of mechanical design experience in semiconductor equipment.
• Proficiency in 3D CAD: Creo, SolidWorks, Inventor, CATIA, NX.
• Knowledge of tolerances, GD&T, bearings and linear-motion components.

Responsibilities

• Design mechanical systems and modules for semiconductor packaging equipment.
• Develop 3D models, drawings, BOMs, and documentation.
• Support machine assembly, alignment, testing, and customer qualification.
• Improve existing modules for accuracy, reliability and cost.

Skills

Mechanical design

3D CAD

GD&T

Thermal management

Finite element analysis

Semiconductor equipment

Motion control

Communication

Education

Diploma or Bachelor’s in Mechanical Engineering or related

Tools

Creo

SolidWorks

Inventor

CATIA

NX

Job description

Position title : Mechanical Design Engineer

Location: Admirax St
Working Days: 5 Day A Week
Working hours : 9:00am - 6:00pm
Salary :SGD 4,000 – SGD 6,000/month (Based on experience and technical capability).

Responsibilities:

• Design mechanical systems and modules for TCB, flip-chip, die-bonding, and advanced semiconductor packaging equipment.

• Develop mechanical concepts, 3D models, detailed drawings, assembly drawings, BOMs, and technical documentation.

• Design equipment modules such as:

  • Wafer handling systems

  • Substrate, strip, panel, or glass-panel handling systems

  • Die ejection, die pickup, and die transfer mechanisms

  • Precision XY, XYZ, XYZT, and multi-axis positioning stages

  • Bondheads and thermal bondheads

  • Micro-Z, force-control, compliance, and tip-tilt mechanisms

  • Heating, cooling, vacuum, gas, and thermal isolation structures

  • Conversion kits, change parts, fixtures, tooling, nests, and bond tools

• Select suitable mechanical and motion components, including bearings, linear guides, motors, encoders, actuators, load cells, heaters, sensors, springs, and flexures.

• Conduct tolerance stack-up and design reviews for critical precision assemblies.

• Consider positioning accuracy, repeatability, structural stiffness, vibration, thermal expansion, force transmission, alignment, and serviceability in the design.

• Work closely with process, electrical, software, vision, motion-control, manufacturing, procurement, and service teams.

• Support machine assembly, alignment, integration, testing, troubleshooting, and customer qualification.

• Investigate machine problems and implement practical design improvements.

• Improve existing modules for better accuracy, reliability, cycle time, manufacturability, and cost.

• Maintain proper engineering documentation and design-change records.

Requirements:

• Diploma or bachelor’s degree in Mechanical Engineering, Mechatronics, Precision Engineering, Automation, or a related discipline.

• Approximately 2 or more years of mechanical design experience in semiconductor equipment, precision automation, machine building, motion systems, or related industries.

• Proficiency in 3D mechanical CAD software such as Creo, SolidWorks, Inventor, CATIA, NX, or equivalent.

• Able to prepare detailed manufacturing and assembly drawings.

• Good understanding of:

  • Fits and tolerances

  • GD&T

  • Bearings and linear-motion components

  • Machining and fabrication processes

  • Material selection and surface treatment

  • Mechanical assembly and alignment

• Able to develop practical mechanism concepts rather than only produce drawings from instructions.

• Willing to support machine assembly, debugging, testing, and continuous improvement.

• Experience in semiconductor packaging or semiconductor automation equipment.

• Experience designing precision, high-stiffness, or thermally stable machine modules.

• Knowledge of thermal expansion, heater integration, thermal isolation, and temperature uniformity.

• Experience with precision motion, force control, vacuum systems, pneumatics, or cleanroom-compatible equipment.

• Experience with tolerance analysis, FEA, thermal simulation, or structural analysis.

• Experience taking a module from concept through assembly, testing, and customer acceptance.

• Familiarity with DFM, DFA, cost reduction, and engineering change control.

• Experience with prototype, customised, or first-of-a-kind equipment development.

+65_96_42_09_89 (Han)
Email: supreme.cc.han()gmail.com

Chaw Chiaw Han | Reg No: R22106723
The Supreme HR Advisory Pte Ltd | EA No: 14C7279