Production Engineer (Backend Semiconductor Equipment / Maintenance Plan)

GMP Technologies; Singapore; On-site; SGD 60,000 - 80,000; Full time

Job summary

A leading semiconductor company in Singapore is looking for a Production Engineer to maintain and enhance semiconductor production equipment. Responsibilities include managing maintenance schedules, planning capacity, and leading efficiency improvement projects. Candidates should have a Degree in Mechanical or Electrical Engineering and at least 5 years of experience in semiconductor manufacturing. Strong problem-solving and interpersonal skills are necessary. Competitive compensation and support for career development are offered.

Qualifications

• Minimum 5 years of experience in handling Dicing, Die Attach, and Wire Bonding.
• Experience in IC assembly and semiconductor manufacturing.
• Knowledge in ISO 9001 & ISO 14000 QEMS implementation.

Responsibilities

• Maintain and improve the Total Productive Maintenance master plan.
• Plan equipment capacity based on business projection.
• Define preventive maintenance programs to improve efficiency.

Skills

Problem solving

Interpersonal skills

Communication skills

Education

Degree/Diploma in Mechanical Engineering or Electrical Engineering

Tools

Dicing machines

Die Attach machines

Wire Bonding machines

Molding machines

Testing machines

Job description

Job Openings Production Engineer (Backend Semiconductor Equipment / Maintenance Plan)

About the job Production Engineer (Backend Semiconductor Equipment / Maintenance Plan)

Responsibilities

• To maintain and improve system for Total Productive Maintenance master plan / schedule to production machines and equipment.
• To plan equipment capacity and resources basing on business projection, address equipment constraints and plan for improvement or upgrades projects to meet company goals and target.
• Define and implement preventive maintenance programs, practices and techniques to increase productivity and product yields, as well as to achieve maintenance KPI and improve operational efficiency aiming for cost effectiveness.
• Maintain, troubleshoot and repair machines, tools and equipment to ensure that they are in good operational working condition.
• Respond to emergencies, break‐down, malfunctions, and other operation problems to minimize disruption to manufacturing processes.
• To support new equipment installation and commissioning.
• To lead projects covering modifications and enhancements to manufacturing equipment as well as leading the plant improvements and reliability initiatives.
• Provide support to daily operations to ensure meeting yield targets and output.
• Benchmark equipment for technology advancement.
• Develop SOP and supportCustomers Audit Exercise.
• Involve other special project, engineering works and duties that assigned by department head.
• To participate, support, and complyin Environmental, Health, Safety policies.

Requirements

• Degree/Diploma in Mechanical Engineering or Electrical Engineering.
• Minimum 5 years of experience in handling Dicing, Die Attach and Wire Bonding, or Molding, Testing machines
• Experience in IC assembly / semiconductor manufacturing
• Experience inTotal Productive Maintenance, MTBF and MTTR
• Knowledge in ISO 9001 & ISO 1400 QEMS implementation
• Good problem solving, Excellent Interpersonal and Communication Skills
• Independent and responsible to work with minimal supervision

GMP Technologies (S) Pte Ltd | EA Licence 11C3793 | EA Personnel: Novita Widjaja | Registration No: R22105960