Process Technician (Dicing/Mask Alignment)

TECNISCO ADVANCED MATERIALS PTE. LTD.; Singapore; On-site; SGD 33,000 - 50,000; Full time

Job summary

TECNISCO ADVANCED MATERIALS PTE. LTD. is seeking an experienced technician to operate wafer dicing and mask alignment equipment. The role involves loading materials, setting machine parameters, and ensuring strict quality and cleanliness standards in a controlled cleanroom environment.

You will inspect wafers and dies, monitor processes, and assist engineers with yield improvements. Prior experience in semiconductor manufacturing and ability to follow precise instructions are essential.

Qualifications

• Diploma / NITEC in Engineering, Semiconductor Technology, or related field
• Minimum 1–3 years of experience in semiconductor manufacturing (dicing or photolithography preferred)
• Familiar with dicing saw and mask aligner equipment
• Ability to read and follow technical work instructions and drawings
• Basic understanding of cleanroom protocols and wafer handling
• Good attention to detail and quality awareness
• Able to work in a cleanroom environment and shift work (if required)

Responsibilities

• Operate wafer dicing machines to cut wafers into individual dies according to specifications
• Perform mask alignment processes using mask aligner equipment for photolithography
• Load and unload wafers, masks, and related materials safely and accurately
• Set up machine parameters (alignment, cutting depth, speed, exposure settings, etc.)
• Conduct routine inspection of wafers and dies to ensure quality standards are met
• Monitor process performance and report any abnormalities or defects
• Perform basic troubleshooting and preventive maintenance on equipment
• Maintain cleanroom discipline and comply with EHS (Environment, Health & Safety) requirements
• Record production data, process parameters, and inspection results accurately
• Support engineers in process improvement and yield enhancement activities

Skills

Attention to detail

Quality awareness

Reading drawings

Follow work instructions

Education

Diploma / NITEC in Engineering or Semiconductor Technology

Tools

Dicing saw

Mask aligner equipment

Job description

Key Responsibilities:

• Operate wafer dicing machines to cut wafers into individual dies according to specifications
• Perform mask alignment processes using mask aligner equipment for photolithography
• Load and unload wafers, masks, and related materials safely and accurately
• Set up machine parameters (alignment, cutting depth, speed, exposure settings, etc.)
• Conduct routine inspection of wafers and dies to ensure quality standards are met
• Monitor process performance and report any abnormalities or defects
• Perform basic troubleshooting and preventive maintenance on equipment
• Maintain cleanroom discipline and comply with EHS (Environment, Health & Safety) requirements
• Record production data, process parameters, and inspection results accurately
• Support engineers in process improvement and yield enhancement activities

Requirements:

• Diploma / NITEC in Engineering, Semiconductor Technology, or related field
• Minimum 1–3 years of experience in semiconductor manufacturing (dicing or photolithography preferred)
• Familiar with dicing saw and mask aligner equipment
• Ability to read and follow technical work instructions and drawings
• Basic understanding of cleanroom protocols and wafer handling
• Good attention to detail and quality awareness
• Able to work in a cleanroom environment and shift work (if required)